Inventor · disambiguated record
Yen-Hsing Chen
Also filed as: CHEN YEN-HSING
24 granted patents·5 pending applications·48 citations·filing 2002–2024
92Inventor score
Top patents by PatentIndex Score
29 records- 0196US11508818B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 22, 2022·2 cites·6 claims
- 0285US12369371B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 22, 2025·1 cites·6 claims
- 0385US6849131B2Truncated dummy plate for process furnaceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 1, 2005·36 cites·8 claims
- 0484US12046640B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 23, 2024·0 cites·7 claims
- 0584US11955519B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 9, 2024·0 cites·7 claims
- 0683US9373705B1Manufacturing method of a fin-shaped field effect transistor and a device thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 21, 2016·3 cites·11 claims
- 0780US11664426B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 30, 2023·0 cites·6 claims
- 0879US12046639B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 23, 2024·0 cites·9 claims
- 0978US9680022B1Semiconductor device having silicon-germanium layer on fin and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·2 cites·9 claims
- 1075US10366991B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·2 cites·22 claims
- 1174US2024384403A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1273US11695067B2High electron mobility transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 4, 2023·0 cites·8 claims
- 1372US11257939B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·1 cites·17 claims
- 1471US12159930B2High electron mobility transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 1571US9899498B2Semiconductor device having silicon-germanium layer on fin and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 20, 2018·1 cites·11 claims
- 1670US12224339B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 11, 2025·0 cites·7 claims
- 1768US11557666B2High electron mobility transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·8 claims
- 1866US11563088B2Semiconductor device with strain relaxed layerUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 24, 2023·0 cites·10 claims
- 1965US12084762B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 2061US11355626B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 7, 2022·0 cites·8 claims
- 2159US11616135B2High electron mobility transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 28, 2023·0 cites·8 claims
- 2258US10644131B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 5, 2020·0 cites·8 claims
- 2355US12205905B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 21, 2025·0 cites·13 claims
- 2454US9660086B2Fin-shaped field effect transistorUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 23, 2017·0 cites·9 claims
- 2552US10388756B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 20, 2019·0 cites·13 claims
- 2649US2022344474A1Superlattice structureUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 2749US2023163205A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 2844US2005055566A1Computer system and method for controlling the sameFiled 2004·Application pending·0 cites
- 2944US2005124169A1Truncated dummy plate for process furnaceTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →