Inventor · disambiguated record
Yen-Pu Chen
Also filed as: CHEN YEN-PU
4 granted patents·8 pending applications·4 citations·filing 2016–2025
61Inventor score
Top patents by PatentIndex Score
12 records- 0182US9837282B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·3 cites·12 claims
- 0273US2025349769A1Thermal performance of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0373US2025372480A1Heat dissipation for hot spotsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0469US9761460B1Method of fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·16 claims
- 0568US2025218892A1Heat dissipation for hot spotsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0668US2025218987A1Thermal performance of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025349666A1Semiconductor package with heat spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025343104A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025372572A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025364458A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1143US10395999B1Method for monitoring fin removalUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 27, 2019·0 cites·15 claims
- 1240US10747099B2PhotomaskUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 18, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →