Inventor · disambiguated record
Yew Cheong
Also filed as: CHEONG YEW W · CHEONG YEW WEE
6 granted patents·3 pending applications·139 citations·filing 2002–2008
84Inventor score
Top patents by PatentIndex Score
9 records- 0186US6713366B2Method of thinning a wafer utilizing a laminated reinforcing layer over the device sideINTEL CORP·Filed 2002·Granted Mar 30, 2004·58 cites·27 claims
- 0283US7005317B2Controlled fracture substrate singulationINTEL CORP·Filed 2003·Granted Feb 28, 2006·33 cites·24 claims
- 0382US7172951B2Apparatus for controlled fracture substrate singulationINTEL CORP·Filed 2005·Granted Feb 6, 2007·10 cites·16 claims
- 0476US7179683B2Substrate grooves to reduce underfill fillet bridgingINTEL CORP·Filed 2004·Granted Feb 20, 2007·36 cites·27 claims
- 0544US7210987B2Wafer grinding methodINTEL CORP·Filed 2004·Granted May 1, 2007·1 cites·17 claims
- 0644US2009025882A1Die molding for flip chip molded matrix array package using uv curable tapeINTEL CORP·Filed 2008·Application pending·0 cites
- 0738US7465368B2Die molding for flip chip molded matrix array package using UV curable tapeINTEL CORP·Filed 2003·Granted Dec 16, 2008·1 cites·12 claims
- 0834US2005221722A1Wafer grinding using an adhesive gel materialCHEONG YEW W·Filed 2004·Application pending·0 cites
- 0929US2005126686A1Combination back grind tape and underfill for flip chipsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →