Die molding for flip chip molded matrix array package using uv curable tape

Abstract

An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.

1 - 12 . (canceled) 
     
     
         13 . A system comprising:
 a conveyor to carry a strip of arrays of flip chips; and   a roller assembly to laminate ultraviolet (UV) curable tape on backside of a flip chip, the UV curable tape having an adhesive strength.   
     
     
         14 . The system of  claim 13  further comprising:
 a mold assembly to apply a mold film on the taped flip chip.   
     
     
         15 . The system of  claim 13  further comprising:
 a UV source to irradiate the molded flip chip with a radiation dosage sufficient to reduce the adhesive strength of the UV curable tape.   
     
     
         16 . The system of  claim 15  further comprising:
 a tape remover to remove the UV curable tape from the flip chip.   
     
     
         17 . A system comprising:
 a wafer holder to hold a wafer; and   a tape mounting device to mount a double functional tape to backside of the wafer, the double functional tape including a binding tape and a ultraviolet (UV) curable tape having an adhesive strength.   
     
     
         18 . The system of  claim 17  further comprising:
 a wafer saw to singulate the wafer into a die, the die being attached to a strip of array of flip chips, the wafer saw cutting though the UV curable tape and cutting partially the binding tape.   
     
     
         19 . The system of  claim 18  further comprising:
 a mold assembly to apply a mold film on the strip.   
     
     
         20 . The system of  claim 19  further comprising:
 a UV source to irradiate the molded strip with a radiation dosage sufficient to reduce the adhesive strength of the UV curable tape.   
     
     
         21 . The system of  claim 19  further comprising:
 a tape remover to remove the UV curable tape from the array of flip chips.