Inventor · disambiguated record
Yen-Shih Ho
Also filed as: HO YEN-SHIH
86 granted patents·18 pending applications·640 citations·filing 1997–2025
99Inventor score
Files withXINTEC INC71TAIWAN SEMICONDUCTOR MFG12VANGUARD INT SEMICONDUCT CORP4CHANG SHU-MING3LEE HUNG-JEN2
Top patents by PatentIndex Score
104 records- 0197US6329234B1Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flowTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Dec 11, 2001·212 cites·34 claims
- 0296US10109559B2Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Oct 23, 2018·29 cites·19 claims
- 0392US6472721B2Dual damascene interconnect structures that include radio frequency capacitors and inductorsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 29, 2002·60 cites·13 claims
- 0490US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0587US8409925B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2011·Granted Apr 2, 2013·8 cites·18 claims
- 0686US7370403B1Method of fabricating a planar spiral inductor structure having an enhanced Q valueTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 13, 2008·50 cites·14 claims
- 0785US9633935B2Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 25, 2017·5 cites·24 claims
- 0885US8673686B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2012·Granted Mar 18, 2014·7 cites·14 claims
- 0985US7592891B2Planar spiral inductor structure having enhanced Q valueTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Sep 22, 2009·14 cites·15 claims
- 1084US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 1181US10050006B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Aug 14, 2018·3 cites·10 claims
- 1279US8692358B2Image sensor chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Apr 8, 2014·5 cites·8 claims
- 1377US9881889B2Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Granted Jan 30, 2018·4 cites·18 claims
- 1477US6096629AUniform sidewall profile etch method for forming low contact leakage schottky diode contactTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Aug 1, 2000·53 cites·10 claims
- 1575US10424540B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Sep 24, 2019·2 cites·13 claims
- 1675US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 1775US2025357159A1Methods of transferring dies and die bonded structuresVANGUARD INT SEMICONDUCT CORP·Filed 2025·Application pending·0 cites
- 1874US10152180B2Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Dec 11, 2018·2 cites·28 claims
- 1974US9997473B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Jun 12, 2018·2 cites·23 claims
- 2074US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 2174US8975755B2Chip packageXINTEC INC·Filed 2014·Granted Mar 10, 2015·3 cites·20 claims
- 2273US9653422B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 2373US9611143B2Method for forming chip packageXINTEC INC·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 2473US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
- 2573US8779558B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 2672US9887229B2Sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Feb 6, 2018·2 cites·4 claims
- 2772US7294544B1Method of making a metal-insulator-metal capacitor in the CMOS processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 13, 2007·44 cites·42 claims
- 2871US9601460B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Mar 21, 2017·2 cites·21 claims
- 2971US8900924B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Dec 2, 2014·2 cites·30 claims
- 3071US6881996B2Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 19, 2005·15 cites·8 claims
- 3170US9331256B2Semiconductor structure with sensor chip and landing padsXINTEC INC·Filed 2014·Granted May 3, 2016·2 cites·13 claims
- 3269US9334156B2Chip package and method thereofXINTEC INC·Filed 2015·Granted May 10, 2016·2 cites·19 claims
- 3369US9331024B2IC wafer having electromagnetic shielding effects and method for making the sameXINTEC INC·Filed 2013·Granted May 3, 2016·2 cites·20 claims
- 3469US9153707B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 6, 2015·0 cites·20 claims
- 3568US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 3668US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
- 3768US9334158B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted May 10, 2016·2 cites·20 claims
- 3867US10153237B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Dec 11, 2018·1 cites·22 claims
- 3967US9024437B2Chip package and method for forming the sameYEN YU-LIN·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 4065US12474525B2Semiconductor device and fabrication method thereofVANGUARD INT SEMICONDUCT CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 4165US12400883B2Structure of transferring dies for use in mass transferring processVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted Aug 26, 2025·0 cites·7 claims
- 4265US7038294B2Planar spiral inductor structure with patterned microelectronic structure integral theretoTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted May 2, 2006·12 cites·2 claims
- 4365US6812088B1Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·11 cites·19 claims
- 4464US9978788B2Photosensitive module and method for forming the sameXINTEC INC·Filed 2016·Granted May 22, 2018·1 cites·18 claims
- 4564US9275958B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 1, 2016·1 cites·15 claims
- 4663US9640683B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 4763US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 4863US8981497B2Chip package structure and method for forming the sameYIU HO-YIN·Filed 2012·Granted Mar 17, 2015·0 cites·18 claims
- 4962US11476293B2Manufacturing method of chip packageXINTEC INC·Filed 2020·Granted Oct 18, 2022·0 cites·9 claims
- 5062US10096635B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Oct 9, 2018·1 cites·16 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →