Inventor · disambiguated record
Yeon Seung Jung
Also filed as: JUNG YEON SEUNG
6 granted patents·5 pending applications·52 citations·filing 2010–2024
80Inventor score
Top patents by PatentIndex Score
11 records- 0194US9941253B1Semiconductor packages including interconnectors and methods of fabricating the sameSK HYNIX INC·Filed 2017·Granted Apr 10, 2018·26 cites·17 claims
- 0292US8487445B1Semiconductor device having through electrodes protruding from dielectric layerDO WON CHUL·Filed 2010·Granted Jul 16, 2013·20 cites·16 claims
- 0378US9847322B2Semiconductor packages including through mold ball connectors and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Dec 19, 2017·3 cites·14 claims
- 0476US10361141B2Semiconductor packages relating to thermal transfer plate and methods of manufacturing the sameSK HYNIX INC·Filed 2018·Granted Jul 23, 2019·2 cites·20 claims
- 0562US8900995B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 2, 2014·1 cites·20 claims
- 0661US2025191982A1Techniques for in-situ testing of stacked semiconductor componentsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0757US11721680B2Semiconductor package having a three-dimensional stack structureSK HYNIX INC·Filed 2021·Granted Aug 8, 2023·0 cites·21 claims
- 0857US2024306403A1Stacked semiconductor deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0951US2015110667A1High-strength and high-ductility steel sheet and method of manufacturing the sameUNIV YONSEI IACF·Filed 2014·Application pending·0 cites
- 1034US2012045358A1High manganese nitrogen-containing steel sheet having high strength and high ductility, and method for manufacturing the sameLEE YOUNG KOOK·Filed 2010·Application pending·0 cites
- 1134US2017179078A1Semiconductor packages and methods of manufacturing the sameSK HYNIX INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →