Inventor · disambiguated record
Yeongkwon Ko
Also filed as: KO YEONGKWON
24 granted patents·23 pending applications·19 citations·filing 2020–2025
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD47
Top patents by PatentIndex Score
47 records- 0196US11424172B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 23, 2022·6 cites·12 claims
- 0295US11869821B2Semiconductor package having molding layer with inclined side wallSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·4 cites·20 claims
- 0394US11923343B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·20 claims
- 0492US12062639B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·2 cites·20 claims
- 0590US11462462B2Semiconductor packages including a recessed conductive postSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·19 claims
- 0684US2025300140A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0784US2025062248A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0882US12362328B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0980US11239171B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
- 1079US12165991B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1179US2025357216A1Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1278US11721669B2Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·17 claims
- 1378US2024321666A1Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1477US12002726B2Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 1577US11996367B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1677US2024379478A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1776US2025167137A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1875US12094794B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 1973US2025300137A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2072US11594499B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 2171US11694963B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 2271US2024203945A1Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2370US11610828B2Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·15 claims
- 2470US11538792B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 2569US12237240B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 2669US11515226B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2765US2025167061A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2864US12476160B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·14 claims
- 2964US12355004B2Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 3062US11923340B2Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 3159US2025029955A1Semiconductor package having an inorganic layer on a mold layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3258US2025167031A1Carrier substrate and manufacturing method of semiconductor package using sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3357US12406888B2Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·16 claims
- 3457US2025174599A1Semiconductor package and semiconductor package manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3557US2025174573A1Packaged semiconductor chips having protected identification marks thereinSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3656US2025079250A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3756US2024178191A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3856US2024312823A1Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3955US2024297150A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4053US2024321667A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4153US2024213109A1Semiconductor package with semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4253US2025015025A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4352US2024321744A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4451US2024157481A1Semiconductor chip splitting method using a laser and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4551US2024387420A1Semiconductor package in a stack formSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4647US12218096B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 4747US11791282B2Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →