Inventor · disambiguated record

Yen-Ping Wang

Also filed as: WANG YEN-PING

77 granted patents·17 pending applications·193 citations·filing 2001–2025

98Inventor score

Technology areasH10W H10D H05B H03K H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD55 TAIWAN SEMICONDUCTOR MFG12 GRENERGY OPTO INC6 WANG YEN-PING4 IND TECH RES INST3

Top patents by PatentIndex Score

94 records

0196US12374652B2Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·2 cites·20 claims
0294US9966321B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·8 cites·20 claims
0393US9337154B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·14 cites·20 claims
0491US11348874B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
0591US9818722B1Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·7 cites·20 claims
0691US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
0790US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
0889US9497861B2Methods and apparatus for package with interposersTAIWAN SEMIDONDUCTOR MFG COMPANY LTD·Filed 2012·Granted Nov 15, 2016·10 cites·20 claims
0989US7719325B1Active-load dominant circuit for common-mode glitch interference cancellationGRENERGY OPTO INC·Filed 2008·Granted May 18, 2010·18 cites·11 claims
1088US12322670B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·1 cites·20 claims
1186US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
1285US11114357B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
1384US9653417B2Method for singulating packaged integrated circuits and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 16, 2017·5 cites·20 claims
1484US8564363B1Pulse filter and bridge driver using the sameWANG YEN-PING·Filed 2012·Granted Oct 22, 2013·7 cites·8 claims
1584US7615426B2PMOS transistor with discontinuous CESL and method of fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 10, 2009·11 cites·19 claims
1684US2025349760A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1782US11855011B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·17 claims
1882US9543263B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·4 cites·20 claims
1982US7727845B2Ultra shallow junction formation by solid phase diffusionTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 1, 2010·10 cites·29 claims
2082US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2181US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
2280US11569562B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·1 cites·20 claims
2380US11515173B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
2479US10269640B2Method for singulating packaged integrated circuits and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
2579US2024363544A1Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2678US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
2778US8217583B2Gas-discharge lamp controller utilizing a novel reheating frequency generation mechanismWANG YEN-PING·Filed 2010·Granted Jul 10, 2012·5 cites·10 claims
2878US2024387979A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2977US11742219B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
3077US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
3176US9263405B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·3 cites·20 claims
3276US2025349750A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3375US12062619B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
3475US10522437B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·1 cites·20 claims
3575US2024363366A1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3674US12132247B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
3774US10276404B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
3874US9064873B2Singulated semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·3 cites·20 claims
3973US12080563B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
4072US11239096B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
4171US12046480B2Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
4271US10163854B2Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
4371US9953942B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·1 cites·20 claims
4471US7867860B2Strained channel transistor formationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 11, 2011·13 cites·21 claims
4571US6569346B1Ferrite with high permeability and high dielectric constant and method for making the sameIND TECH RES INST·Filed 2001·Granted May 27, 2003·10 cites·7 claims
4670US11894330B2Methods of manufacturing a semiconductor device including a joint adjacent to a postTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
4770US7498641B2Partial replacement silicide gateTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 3, 2009·4 cites·16 claims
4870US2022336386A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4969US10727082B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·1 cites·20 claims
5068US11417616B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims

Showing the top 50 of 94 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →