Integrated circuit packages and methods of forming the same

Abstract

Embodiments include a crack stopper structure surrounding an embedded integrated circuit die, and the formation thereof. The crack stopper structure may include multiple layers separated by a fill layer. The layers of the crack stopper may include multiple sublayers, some of the sublayers providing adhesion, hardness buffering, and material gradients for transitioning from one layer of the crack stopper structure to another layer of the crack stopper structure.

What is claimed is: 
     
         1 . A method comprising:
 forming a first crack stopper layer of a first crack stopper structure over a first integrated circuit die and along sidewalls of the first integrated circuit die;   forming a second crack stopper layer of the first crack stopper structure over the first crack stopper layer;   depositing a first gap-filling dielectric around the first crack stopper structure and the first integrated circuit die;   prior to forming the second crack stopper layer, forming a dielectric film over the first crack stopper layer;   bonding a second integrated circuit die to the first integrated circuit die;
 forming a second crack stopper structure over and along sidewalls of the second integrated circuit die; and 
 depositing a second gap-filling dielectric around the second crack stopper structure and the second integrated circuit die.