Inventor · disambiguated record
Ye Wang
Also filed as: WANG YE · WANG YE-WEN
33 granted patents·15 pending applications·151 citations·filing 2004–2024
96Inventor score
Top patents by PatentIndex Score
48 records- 0195US10526701B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2015·Granted Jan 7, 2020·6 cites·9 claims
- 0293US8638178B1Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic sealsWANG YE·Filed 2012·Granted Jan 28, 2014·18 cites·4 claims
- 0393US7955885B1Methods of forming packaged micro-electromechanical devicesINTEGRATED DEVICE TECH·Filed 2009·Granted Jun 7, 2011·27 cites·7 claims
- 0491US11170786B1Federated speaker verification method based on differential privacyHARBIN INSTITUTE OF TECH SHENZHEN INSTITUTE OF SCIENCE AND TECH INNOVATION·Filed 2021·Granted Nov 9, 2021·10 cites·6 claims
- 0589US8610336B1Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodiesWANG YE·Filed 2011·Granted Dec 17, 2013·12 cites·8 claims
- 0688US7939990B2Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variationsINTEGRATED DEVICE TECH·Filed 2009·Granted May 10, 2011·17 cites·20 claims
- 0784US9269678B2Bond pad structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted Feb 23, 2016·6 cites·14 claims
- 0884US8361331B2MEMS mirror system for laser printing applicationsMIRADIA INC·Filed 2011·Granted Jan 29, 2013·6 cites·18 claims
- 0983US8106724B1Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factorWANG YE·Filed 2009·Granted Jan 31, 2012·12 cites·9 claims
- 1081US7834524B2Micro-electromechanical devices having variable capacitors therein that compensate for temperature-induced frequency drift in acoustic resonatorsINTEGRATED DEVICE TECH·Filed 2009·Granted Nov 16, 2010·10 cites·19 claims
- 1178US9824828B2High specific capacitance and high power density of printed flexible micro-supercapacitorsUNIV SINGAPORE TECHNOLOGY & DESIGN·Filed 2013·Granted Nov 21, 2017·3 cites·6 claims
- 1276US11479856B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2019·Granted Oct 25, 2022·0 cites·22 claims
- 1376US9691703B2Bond pad structure with dual passivation layersUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 27, 2017·2 cites·14 claims
- 1475US8530258B2Method and apparatus for MEMS oscillatorYANG XIAO·Filed 2011·Granted Sep 10, 2013·3 cites·19 claims
- 1574US7863697B2Method and apparatus for MEMS oscillatorMIRADIA INC·Filed 2007·Granted Jan 4, 2011·6 cites·17 claims
- 1668US8105736B2Method and system for overlay correction during photolithographyYANG XIAO·Filed 2008·Granted Jan 31, 2012·2 cites·16 claims
- 1768US2020079022A1Systems and methods of hierarchical material design for additive fabricationMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Application pending·0 cites
- 1866US8314984B2Method and system for optical MEMS with flexible landing structuresYANG XIAO·Filed 2008·Granted Nov 20, 2012·4 cites·17 claims
- 1965US7453624B2Projection display system including a high fill ratio silicon spatial light modulatorMIRADIA INC·Filed 2006·Granted Nov 18, 2008·3 cites·7 claims
- 2065US2021402701A1Systems and methods of hierarchical material design for additive fabricationMASSACHUSETTS INST TECHNOLOGY·Filed 2021·Application pending·0 cites
- 2164US12412969B2Coaxial filter and communication radio frequency deviceSUZHOU LUXSHARE TECH CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·17 claims
- 2262US8159740B2Fabrication of a high fill ratio silicon spatial light modulatorYANG XIAO·Filed 2010·Granted Apr 17, 2012·1 cites·29 claims
- 2362US7898561B2MEMS mirror system for laser printing applicationsMIRADIA INC·Filed 2008·Granted Mar 1, 2011·2 cites·17 claims
- 2457US2016167306A1Systems and methods of hierarchical material design for additive fabricationMASSACHUSETTS INST TECHNOLOGY·Filed 2014·Application pending·0 cites
- 2556US7675670B2Fabrication of a high fill ratio silicon spatial light modulatorMIRADIA INC·Filed 2006·Granted Mar 9, 2010·1 cites·23 claims
- 2655US2023367997A1Reconfigurable wavelength selective splitterMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2022·Application pending·0 cites
- 2755US2025383162A1Heat dissipation element and thermosiphon radiatorSHENZHEN ENVICOOL TECH CO LTD·Filed 2023·Application pending·0 cites
- 2853US2025258285A1Transducer Assembly and Ultrasonic Sensor with Absorbing ElementTE CONNECTIVITY SOLUTIONS GMBH·Filed 2024·Application pending·0 cites
- 2952US8908255B2Fabrication of a high fill ratio silicon spatial light modulatorYANG XIAO·Filed 2012·Granted Dec 9, 2014·0 cites·23 claims
- 3049US2009002805A1Projection display system including a high fill ratio silicon spatial light modulatorMIRADIA INC·Filed 2008·Application pending·0 cites
- 3149US2024357935A1Heat-utilizing power generation module and manufacturing method thereforSANOH IND CO LTD·Filed 2022·Application pending·0 cites
- 3248US9217857B2Multi-state shutter assemblies having segmented drive electrode setsPIXTRONIX INC·Filed 2013·Granted Dec 22, 2015·0 cites·28 claims
- 3348US2024202325A1System and Method for Explainable Anomaly DetectionMITSUBISHI ELECTRICRESEARCH LABORATORIES INC·Filed 2022·Application pending·0 cites
- 3447US10847785B2Group IV-VI compound graphene anode with catalystAIRBUS SINGAPORE PRIVATE LTD·Filed 2016·Granted Nov 24, 2020·0 cites·15 claims
- 3547US8119432B2Method and apparatus for MEMS oscillatorYANG XIAO·Filed 2010·Granted Feb 21, 2012·0 cites·10 claims
- 3646US12150277B2Hybrid heat sinkSHENZHEN ENVICOOL TECH CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 3746US11002763B2Probe for pic die with related test assembly and methodGLOBALFOUNDRIES US INC·Filed 2018·Granted May 11, 2021·0 cites·19 claims
- 3845US11522725B2Reducing amount of helper data in silicon physical unclonable functions via lossy compression without production-time error characterizationUNIV TEXAS·Filed 2018·Granted Dec 6, 2022·0 cites·3 claims
- 3944US11802669B1LED straight tube lamp with an end face switch for a tone adjustment and a power adjustmentHENGDIAN GROUP TOSPO LIGHTING CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·7 claims
- 4044US2008164542A1Methods and systems for wafer level packaging of mems structuresMIRADIA INC·Filed 2008·Application pending·0 cites
- 4143US11929537B2Resonator filterKUNSHAN LUXSHARE RF TECH CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·19 claims
- 4243US2015369629A1Angle SensorNINEBOT TIANJIN TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 4343US2008004850A1Method of Universal Formability Analysis in Sheet Metal Forming by Utilizing Finite Element Analysis and Circle Grid AnalysisPHIDA INC·Filed 2006·Application pending·0 cites
- 4442US7522330B2High fill ratio silicon spatial light modulatorMIRADIA INC·Filed 2006·Granted Apr 21, 2009·0 cites·70 claims
- 4542US2013141671A1Liquid crystal display device, backlight unit, and heat dissipating method thereofWANG YE-WEN·Filed 2011·Application pending·0 cites
- 4640US11635734B2Interval error observer-based aircraft engine active fault tolerant control methodUNIV DALIAN TECH·Filed 2019·Granted Apr 25, 2023·0 cites·1 claims
- 4740US2010194246A1Thin-Film Bulk Acoustic Resonators Having Reduced Susceptibility to Process-Induced Material Thickness VariationsINTEGRATED DEVICE TECH·Filed 2009·Application pending·0 cites
- 4832US2004166602A1Electro-thermally actuated lateral-contact microrelay and associated manufacturing processFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →