Inventor · disambiguated record
Yen-Ju Wu
Also filed as: WU YEN JU
2 granted patents·16 pending applications·5 citations·filing 2016–2025
50Inventor score
Top patents by PatentIndex Score
18 records- 0179US9612357B1Device for receiving/transmitting terahertz-gigahertz wave and the application thereofARCHIT LENS TECH INC·Filed 2016·Granted Apr 4, 2017·3 cites·38 claims
- 0277US2025357198A1Etch stop layer for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0370US9691509B1Terahertz-gigahertz system housing capable of minimizing interference and noiseARCHIT LENS TECH INC·Filed 2016·Granted Jun 27, 2017·2 cites·32 claims
- 0467US2024332070A1Etch stop layer for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0558US2025112088A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0657US2025132247A1Interconnection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0757US2025118598A1Interconnection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0856US2024420994A1Interconnect layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0956US2024413010A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1055US2024413074A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1155US2024413075A1Interconnect structure having heat dissipation capability and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1254US2024087980A1Etching-damage-free intermetal dielectric layer with thermal dissipation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1352US2024038666A1Interconnect layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1451US2024038665A1Interconnection structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1547US2017293046A1Large aperture terahertz-gigahertz lens systemARCHIT LENS TECH INC·Filed 2016·Application pending·0 cites
- 1631US2016197298A1Organic/inorganic electroluminescent deviceUNIV NAT CENTRAL·Filed 2016·Application pending·0 cites
- 1730US2018292633A1Terahertz-gigahertz illuminatorARCHIT LENS TECH INC·Filed 2017·Application pending·0 cites
- 1830US2018203212A1Terahertz-gigahertz fisheye lens systemARCHIT LENS TECH INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →