Inventor · disambiguated record

Yen-Tsai Yi

Also filed as: Yi Yen-Tsai

14 granted patents·11 pending applications·24 citations·filing 2016–2025

88Inventor score

Technology areasH10W H10D H10N H10K H10P

Files withUNITED MICROELECTRONICS CORP25

Top patents by PatentIndex Score

25 records

0195US11968906B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 23, 2024·5 cites·8 claims
0290US10199269B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·6 cites·10 claims
0389US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
0488US2025344612A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
0586US10134629B1Method for manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 20, 2018·4 cites·11 claims
0684US12389807B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Aug 12, 2025·0 cites·9 claims
0784US12279536B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 15, 2025·0 cites·6 claims
0879US2025212696A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
0977US10497607B2Manufacturing method of interconnect structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 3, 2019·2 cites·20 claims
1073US2024397832A1Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1173US2025081568A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1268US12089504B2Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
1366US12183801B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 31, 2024·0 cites·7 claims
1466US10867808B1Manufacturing method of connection structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 15, 2020·1 cites·19 claims
1560US12336245B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·12 claims
1660US2025349765A1Semiconductor structure including hybrid bond contact and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1760US2025385183A1Conductive structure of copper and aluminum and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1858US10497617B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·0 cites·9 claims
1958US2025089448A1Organic light-emitting diode display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
2057US2025248103A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
2156US12426515B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 23, 2025·0 cites·11 claims
2245US11450564B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 20, 2022·0 cites·7 claims
2345US2022122915A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
2438US2020006517A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
2536US2018366368A1Method for forming contact structureUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →