Inventor · disambiguated record
Yiqun Bai
Also filed as: BAI YIQUN
19 granted patents·50 pending applications·355 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
69 records- 0198US7432592B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2005·Granted Oct 7, 2008·294 cites·9 claims
- 0292US8916981B2Epoxy-amine underfill materials for semiconductor packagesXIU YONGHAO·Filed 2013·Granted Dec 23, 2014·31 cites·25 claims
- 0386US8012808B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2008·Granted Sep 6, 2011·15 cites·12 claims
- 0481US12099245B2Completely encapsulated optical multi chip packageINTEL CORP·Filed 2020·Granted Sep 24, 2024·1 cites·20 claims
- 0580US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 0677US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 0775US11688634B2Trenches in wafer level packages for improvements in warpage reliability and thermalsINTEL CORP·Filed 2019·Granted Jun 27, 2023·2 cites·27 claims
- 0869US2024402445A1Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2024·Application pending·0 cites
- 0968US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 1068US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 1165US9611372B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2016·Granted Apr 4, 2017·1 cites·20 claims
- 1263US9269596B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2013·Granted Feb 23, 2016·1 cites·20 claims
- 1362US12130482B2Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·19 claims
- 1462US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 1561US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1658US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2025110295A1Polyethylene oxide-based optical adhesiveINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1957US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2456US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2556US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2756US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2855US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 3154US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3254US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3354US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 3454US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 3554US2025306306A1Lid design, materials and process for passive fau alignment in co-package opticsINTEL CORP·Filed 2024·Application pending·0 cites
- 3653US11749585B2High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit packageINTEL CORP·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 3753US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 3853US2024213169A1Low die height glass substrate device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 3953US2024222210A1Glass substrate fabrication using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4053US2024222238A1Apparatus and method for attaching an optical component using no remelt metallurgyINTEL CORP·Filed 2022·Application pending·0 cites
- 4153US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4253US2024222345A1Die attach in glass core package through organic-to-organic bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4353US2024219654A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4453US2024112971A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 4653US2024222243A1Apparatus and method for attaching an optical component using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4753US2024222304A1Methods and apparatus to reduce solder bump bridging between two substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 4953US2024219655A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 5053US2024222257A1Glass substrate device with plated through holesINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →