Inventor · disambiguated record
Yi-Ming Chang
Also filed as: CHANG YI · CHANG YI M · CHANG YI-MING
53 granted patents·25 pending applications·127 citations·filing 1983–2025
97Inventor score
Top patents by PatentIndex Score
78 records- 0188US9356249B2Organic electronic device and electric field-induced carrier generation layerIND TECH RES INST·Filed 2014·Granted May 31, 2016·7 cites·23 claims
- 0288US8890191B2Chip package and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Nov 18, 2014·13 cites·16 claims
- 0384US8116101B2Electronic deviceCHANG YI-MING·Filed 2009·Granted Feb 14, 2012·20 cites·12 claims
- 0481US10050006B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Aug 14, 2018·3 cites·10 claims
- 0579US8789692B2Desiccating containerCHANG YI MING·Filed 2010·Granted Jul 29, 2014·6 cites·14 claims
- 0675US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 0774US8919545B2Desiccating containerCHANG YI MING·Filed 2011·Granted Dec 30, 2014·4 cites·10 claims
- 0873US9653422B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 0973US9611143B2Method for forming chip packageXINTEC INC·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 1073US8748926B2Chip package with multiple spacers and method for forming the sameXINTEC INC·Filed 2012·Granted Jun 10, 2014·4 cites·32 claims
- 1172US9224790B2Illumination deviceIND TECH RES INST·Filed 2014·Granted Dec 29, 2015·2 cites·18 claims
- 1271US12433144B2Electrode connection structure and method of forming the sameRAYNERGY TEK INC·Filed 2022·Granted Sep 30, 2025·0 cites·15 claims
- 1367US12396314B2Method of patterning a semiconductor layerRAYNERGY TEK INC·Filed 2022·Granted Aug 19, 2025·0 cites·14 claims
- 1465US10109663B2Chip package and method for forming the sameXINTEC INC·Filed 2016·Granted Oct 23, 2018·1 cites·22 claims
- 1565US9881959B2Chip package and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Jan 30, 2018·1 cites·18 claims
- 1665US7087464B2Method and structure for a wafer level packagingUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 8, 2006·18 cites·12 claims
- 1764US9275958B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 1, 2016·1 cites·15 claims
- 1863US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 1963US2025040334A1Photoelectric device module and manufacturing method thereofRAYNERGY TEK INC·Filed 2024·Application pending·0 cites
- 2061US12302682B2Structure of the photodiodeRAYNERGY TEK INC·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 2161US8785956B2Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Jul 22, 2014·2 cites·20 claims
- 2260US12426493B2Structure of the photodiodeRAYNERGY TEK INC·Filed 2022·Granted Sep 23, 2025·0 cites·11 claims
- 2360US2025324843A1Photoelectric device module and operation method thereofRAYNERGY TEK INC·Filed 2025·Application pending·0 cites
- 2459US12513112B2Network apparatus and network attack blocking method thereofMOXA INC·Filed 2023·Granted Dec 30, 2025·0 cites·12 claims
- 2559US11124662B2Polymer-polyoxometalate composite ink and application thereofRAYNERGY TEK INC·Filed 2019·Granted Sep 21, 2021·0 cites·10 claims
- 2657US8760882B2Wiring structure for improving crown-like defect and fabrication method thereofCHANG YI-MING·Filed 2011·Granted Jun 24, 2014·1 cites·8 claims
- 2757US2024099121A1Block conjugated polymer material and active layer material and organic optoelectronic device using the sameRAYNERGY TEK INC·Filed 2023·Application pending·0 cites
- 2856US10923666B1Hole transporting material, manufacturing method thereof, and organic photodiode thereofRAYNERGY TEK INC·Filed 2019·Granted Feb 16, 2021·0 cites·9 claims
- 2955US12139465B2Non-fullerene acceptor compound containing benzoselenadiazole and organic optoelectronic device including the sameRAYNERGY TEK INC·Filed 2020·Granted Nov 12, 2024·0 cites·12 claims
- 3054US2014076393A1Flexible solar cell and manufacturing method thereofIND TECH RES INST·Filed 2012·Application pending·0 cites
- 3154US2023170425A1Optoelectronic semiconductor structureRAYNERGY TEK INC·Filed 2022·Application pending·0 cites
- 3253US11903304B2Photodiode comprising fluropolymer compoundRAYNERGY TEK INC·Filed 2020·Granted Feb 13, 2024·0 cites·27 claims
- 3353US2022376181A1Organic semiconductor deviceRAYNERGY TEK INC·Filed 2021·Application pending·0 cites
- 3451US4589526AControllable fluid damper for fluid-containing tankROCKWELL INTERNATIONAL CORP·Filed 1984·Granted May 20, 1986·11 cites·5 claims
- 3551US2025007910A1Network apparatus and network authentication method thereofMOXA INC·Filed 2023·Application pending·0 cites
- 3651US2010212228A1Fastening mechanismCOMPAL ELECTRONICS INC·Filed 2009·Application pending·0 cites
- 3750US10686559B2Device for verifying data transmissions and method using the sameHONGFUJIN PREC ELECTRONICS TIANJIN CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·10 claims
- 3850US9426894B2Fabrication method of wiring structure for improving crown-like defectXINTEC INC·Filed 2014·Granted Aug 23, 2016·0 cites·6 claims
- 3949US12094996B2Electronic device and manufacturing method of the sameRAYNERGY TEK INC·Filed 2022·Granted Sep 17, 2024·0 cites·5 claims
- 4049US11051742B2Wearable device and respiration sensing moduleIND TECH RES INST·Filed 2017·Granted Jul 6, 2021·0 cites·22 claims
- 4149US9640488B2Chip package and method for forming the sameXINTEC INC·Filed 2016·Granted May 2, 2017·0 cites·5 claims
- 4249US9395072B2Illumination deviceIND TECH RES INST·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 4348US2024061332A1Method of patterning semiconductor layerRAYNERGY TEK INC·Filed 2022·Application pending·0 cites
- 4447US9236320B2Chip packageXINTEC INC·Filed 2014·Granted Jan 12, 2016·0 cites·28 claims
- 4547US2010213649A1Shock Absorber and Assembling Method of Electronic Device Using the SameCOMPAL ELECTRONICS INC·Filed 2009·Application pending·0 cites
- 4647US2015016070A1Conductive structure and device with the conductive structure as electrodeIND TECH RES INST·Filed 2013·Application pending·0 cites
- 4747US2006272938A1Method of manufacturing a liquid crystal alignment film utilizing long-throw sputteringKUAN TA-SHUANG·Filed 2005·Application pending·0 cites
- 4846US6706638B2Method of forming opening in dielectric layerWINBOND ELECTRONICS CORP·Filed 2001·Granted Mar 16, 2004·4 cites·15 claims
- 4946US2006269466A1Method for manufacturing carbonaceous nanofibersIND TECH RES INST·Filed 2006·Application pending·0 cites
- 5046US2014368360A1Electronic system for tracking and monitoring motorcycle raceHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →