Inventor · disambiguated record
Yi-Chun Chang
Also filed as: CHANG YI-CHUN
20 granted patents·12 pending applications·107 citations·filing 1997–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21MINIWIZ CO LTD5UNITED MICROELECTRONICS CORP3IND TECH RES INST2
Top patents by PatentIndex Score
32 records- 0196US11996321B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·4 cites·20 claims
- 0296US11664272B2Etch profile control of gate contact openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0393US11961893B2Contacts for semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0487US2025366018A1Etch profile control of via openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0585US2025351501A1Contacts for semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0684US2025338594A1Conductive capping for work function layer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0781US12349395B2Inter block for recessed contacts and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0881US12107003B2Etch profile control of gate contact openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0980US2025301694A1Inter block for recessed contacts and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US2024395607A1Etch profile control of gate contact openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1178US2024371956A1Conductive capping for work function layer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US2024250143A1Contacts for semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1375US2024387266A1Recessed contacts at line end and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US7640070B2Real-time fault detection and classification system in use with a semiconductor fabrication processIND TECH RES INST·Filed 2007·Granted Dec 29, 2009·8 cites·9 claims
- 1574US7318006B2Alarm analysis methods and systems capable of multi-purpose functionIND TECH RES INST·Filed 2005·Granted Jan 8, 2008·9 cites·36 claims
- 1673US2023361185A1Etch profile control of via openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1772US11967622B2Inter block for recessed contacts and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 1871US12119386B2Conductive capping for work function layer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 1970US10384373B2Mobile plastic recycling system and recycling method using the sameMINIWIZ CO LTD·Filed 2017·Granted Aug 20, 2019·1 cites·15 claims
- 2070US2024079409A1Semiconductor device structure with conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2169US11749732B2Etch profile control of via openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 2269US6232238B1Method for preventing corrosion of bonding pad on a surface of a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 15, 2001·40 cites·9 claims
- 2368US12107007B2Recessed contacts at line end and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 2463US11810919B2Semiconductor device structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 2562US9949565B1Supporting assembly and furniture comprising the sameMINIWIZ CO LTD·Filed 2017·Granted Apr 24, 2018·2 cites·13 claims
- 2661US6001742AMethod for etching tantalum oxide layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·26 cites·28 claims
- 2748US12363947B2Structure and formation method of semiconductor device with contact structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 15, 2025·0 cites·20 claims
- 2844US2021108341A1Thermo-shapeable fabrics and articles made therefromMINIWIZ CO LTD·Filed 2018·Application pending·0 cites
- 2944US2019016087A1Composite laminated article and method for manufacturing the sameMINIWIZ CO LTD·Filed 2017·Application pending·0 cites
- 3036US11566422B2Structural joint and sealing element for panelsMINIWIZ CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·5 claims
- 3135US5772882AAnti-clogging device for drain pipe in building constructionFiled 1997·Granted Jun 30, 1998·10 cites·5 claims
- 3230US6136663AMethod of etching silicon nitrideUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 24, 2000·2 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Yi-Chun Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →