Inventor · disambiguated record
Ying-Lien Chen
Also filed as: CHEN YING-LIEN
3 granted patents·1 citations·filing 2017–2018
50Inventor score
Technology areasH10P
Files withUNITED MICROELECTRONICS CORP3
Top patents by PatentIndex Score
3 records- 0166US10153231B2Interconnect structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·1 cites·14 claims
- 0249US10446489B2Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·8 claims
- 0342US10079177B1Method for forming copper material over substrateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →