Inventor · disambiguated record
Ying-Chih Chen
Also filed as: CHEN YING · CHEN YING C · CHEN YING CHIH
56 granted patents·11 pending applications·364 citations·filing 1984–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9MEDIATEK INC7MEGICA CORP7GTE LABORATORIES INC6IND TECH RES INST5
Top patents by PatentIndex Score
67 records- 0196US7521812B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2007·Granted Apr 21, 2009·37 cites·13 claims
- 0295US11621337B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·4 cites·20 claims
- 0394US12040377B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0488US9142527B2Method of wire bonding over active area of a semiconductor circuitLEE JIN-YUAN·Filed 2007·Granted Sep 22, 2015·11 cites·18 claims
- 0587US8026588B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2007·Granted Sep 27, 2011·10 cites·74 claims
- 0686US7508059B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2006·Granted Mar 24, 2009·12 cites·20 claims
- 0785US8138079B2Method of wire bonding over active area of a semiconductor circuitLEE JIN-YUAN·Filed 2007·Granted Mar 20, 2012·8 cites·38 claims
- 0883US8426958B2Stacked chip package with redistribution linesLIN MOU-SHIUNG·Filed 2011·Granted Apr 23, 2013·5 cites·26 claims
- 0982US12408413B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1081US7973401B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2008·Granted Jul 5, 2011·8 cites·23 claims
- 1180US4689793AOptical logic and memory apparatusGTE LABORATORIES INC·Filed 1985·Granted Aug 25, 1987·27 cites·32 claims
- 1279US9153555B2Method of wire bonding over active area of a semiconductor circuitLEE JIN-YUAN·Filed 2007·Granted Oct 6, 2015·5 cites·24 claims
- 1378US8320425B1Pump cavities for diode laser array pumped laser rodsCHEN YING·Filed 2010·Granted Nov 27, 2012·4 cites·28 claims
- 1477US9129962B1Bonding pad arrangment design for multi-die semiconductor package structureMEDIATEK INC·Filed 2014·Granted Sep 8, 2015·3 cites·21 claims
- 1577US7630594B2Optical interconnection moduleIND TECH RES INST·Filed 2007·Granted Dec 8, 2009·9 cites·17 claims
- 1676US8021976B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2003·Granted Sep 20, 2011·15 cites·50 claims
- 1776US4612645AFast polarization-switchable semiconductor lasersGTE LABORATORIES INC·Filed 1984·Granted Sep 16, 1986·20 cites·3 claims
- 1875US9818727B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2016·Granted Nov 14, 2017·2 cites·38 claims
- 1975US7295725B1Electro-optical circuit boardIND TECH RES INST·Filed 2007·Granted Nov 13, 2007·8 cites·21 claims
- 2074US7845058B2Method for assembling camera moduleHON HAI PREC IND CO LTD·Filed 2007·Granted Dec 7, 2010·4 cites·14 claims
- 2174US2025311235A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2273US7592205B2Over-passivation process of forming polymer layer over IC chipMEGICA CORP·Filed 2005·Granted Sep 22, 2009·4 cites·20 claims
- 2371US2025248046A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2469US12289893B2Semiconductor devices including FTJ structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 2567US12336186B2Semiconductor devices having ferroelectric tunnel junction structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2667US7249896B2Array optical sub-assemblyIND TECH RES INST·Filed 2005·Granted Jul 31, 2007·4 cites·11 claims
- 2766US5414724AMonolithic self Q-switched laserNORTH CHINA RESEARCH INST OF E·Filed 1994·Granted May 9, 1995·31 cites·10 claims
- 2864US5319660AMulti-quantum barrier laserMC DONNELL DOUGLAS CORP·Filed 1992·Granted Jun 7, 1994·22 cites·14 claims
- 2963US7577321B2Hybrid electro-optical circuit board and method for fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 18, 2009·2 cites·16 claims
- 3063US2025343132A1Memory devices with via structrues and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3162US10162215B2Automatic backlight control system and method thereofUNIV CHUNG YUAN CHRISTIAN·Filed 2017·Granted Dec 25, 2018·1 cites·10 claims
- 3262US7212702B1Optoelectric converting substrateIND TECH RES INST·Filed 2006·Granted May 1, 2007·3 cites·13 claims
- 3362US5197077ALow divergence laserMC DONNELL DOUGLAS CORP·Filed 1992·Granted Mar 23, 1993·26 cites·10 claims
- 3460US2025331302A1Complementary fet structures with reduced areaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3558US6739022B1Rotary buckle structureFiled 2002·Granted May 25, 2004·8 cites·3 claims
- 3657US7091583B2Method and structure for prevention leakage of substrate stripADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 15, 2006·10 cites·26 claims
- 3757US6698984B1Structure extendible tip shoring barFiled 2002·Granted Mar 2, 2004·11 cites·1 claims
- 3855US9991227B2Bonding pad arrangement design for multi-die semiconductor package structureMEDIATEK INC·Filed 2016·Granted Jun 5, 2018·0 cites·11 claims
- 3954US4685108AOptical multivibratorGTE LABORATORIES INC·Filed 1985·Granted Aug 4, 1987·10 cites·7 claims
- 4053US10497678B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2017·Granted Dec 3, 2019·0 cites·2 claims
- 4153US8742580B2Method of wire bonding over active area of a semiconductor circuitLEE JIN-YUAN·Filed 2007·Granted Jun 3, 2014·0 cites·29 claims
- 4253US2025075539A1Car tailgate handle reinforcing method and its structureHUSHAN AUTOPARTS INC·Filed 2023·Application pending·0 cites
- 4352US9564395B2Bonding pad arrangment design for multi-die semiconductor package structureMEDIATEK INC·Filed 2015·Granted Feb 7, 2017·0 cites·22 claims
- 4450US12040300B2Semiconductor package using hybrid-type adhesiveAIROHA TECH CORP·Filed 2022·Granted Jul 16, 2024·0 cites·17 claims
- 4549US11244913B2Semiconductor packageMEDIATEK INC·Filed 2019·Granted Feb 8, 2022·0 cites·19 claims
- 4649US7919412B2Over-passivation process of forming polymer layer over IC chipMEGICA CORP·Filed 2008·Granted Apr 5, 2011·0 cites·20 claims
- 4749US4878723AOptically controlled semiconductor waveguide interferometer apparatusGTE LABORATORIES INC·Filed 1986·Granted Nov 7, 1989·14 cites·14 claims
- 4848US6948220B2Pet collar buckle structureCHEN YING-CHIH·Filed 2003·Granted Sep 27, 2005·5 cites·1 claims
- 4945US4772118AMethods of and apparatus for measuring picosecond semiconductor laser pulse duration using the internally generated second harmonic emission accompanying the laser outputGTE LABORATORIES INC·Filed 1986·Granted Sep 20, 1988·9 cites·9 claims
- 5043US4611328APolarization stabilized InGaAsP/InP lasersGTE LABORATORIES INC·Filed 1984·Granted Sep 9, 1986·6 cites·2 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →