Inventor · disambiguated record
Yin-Ju Chen
Also filed as: CHEN YIN · CHEN YIN-JU
16 granted patents·25 pending applications·59 citations·filing 1997–2025
90Inventor score
Files withAALTOSEMI INC14UNIMICRON TECHNOLOGY CORP14CHANG SU-YUAN3QING DING PREC ELECTRONICS HUAIAN CO LTD2VICOTEL INC2
Top patents by PatentIndex Score
41 records- 0195US9635757B1Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Apr 25, 2017·17 cites·9 claims
- 0294US9514629B2Vehicle door opening warning system and vehicle door opening warning methodUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Dec 6, 2016·27 cites·8 claims
- 0392US9491865B1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 8, 2016·8 cites·4 claims
- 0481US10616992B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Apr 7, 2020·2 cites·8 claims
- 0566US9159713B1Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Oct 13, 2015·2 cites·14 claims
- 0659US11553602B2Method for manufacturing circuit board with heat dissipation functionQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·10 claims
- 0758US10787635B2Method and kit for expanding circulating tumor cells in vitroUNIV TAIPEI MEDICAL·Filed 2018·Granted Sep 29, 2020·0 cites·10 claims
- 0857US9805875B2Capacitor and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 31, 2017·0 cites·7 claims
- 0957US2016097130A1Preparation method of conductive sponge having effect of shielding electromagnetic waveUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 1057US2025159800A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1156US2024243048A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1256US2017229248A1Manufacturing method for capacitorUNIMICRON TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 1355US9883598B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 30, 2018·0 cites·4 claims
- 1455US9377596B2Optical-electro circuit board, optical component and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 28, 2016·0 cites·4 claims
- 1555US7732594B2Method on clinical applications in head neck cancer by using DSG3 molecule for predicting malignant degree of cancer, serving as a molecular target and using RNA jamming sequence on inhibition-specific of DSG3 expressionUNIV CHANG GUNG·Filed 2009·Granted Jun 8, 2010·0 cites·1 claims
- 1655US2024213137A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1755US2023292446A1Multilayer circuit board with embedded module and method for manufacturing sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2023·Application pending·0 cites
- 1853US2016363974A1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Application pending·0 cites
- 1953US2025014989A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2052US9739963B2Manufacturing method of optical componentUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 22, 2017·0 cites·3 claims
- 2152US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2252US2024282683A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2352US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2451US9581774B2Optical-electro circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Feb 28, 2017·0 cites·6 claims
- 2551US2014158944A1Polyaniline composites and fabrication method thereofNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
- 2650US9335470B2Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 2750US2025323062A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2846US2025308935A1Method for fabricating a package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2946US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3044US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3143US7622456B2Method on clinical applications in head neck cancer by using DSG3 molecule for predicting malignant degree of cancer, serving as a molecular target and using RNA jamming sequence on inhibition-specific of DSG3 expressionNON PROFIT ORGANIZATION CHANG·Filed 2006·Granted Nov 24, 2009·0 cites·1 claims
- 3243US2006098622A1Architecture for a multi-media session controlled networkVICOTEL INC·Filed 2004·Application pending·0 cites
- 3343US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3442US2025246443A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3541US2007002829A1Internet protocol voice loggerCHANG SU-YUAN·Filed 2005·Application pending·0 cites
- 3639US2008028087A1A client/server multimedia system and methodVICOTEL INC·Filed 2006·Application pending·0 cites
- 3739US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3838US2007064896A1System and method for sharing SIP sessionsCHANG SU-YUAN·Filed 2005·Application pending·0 cites
- 3938US2007136441A1Multimedia user interaction over IP networkCHANG SU-YUAN·Filed 2005·Application pending·0 cites
- 4037US2005128955A1Transmission system for network with communication quality indicating capability and the method of the sameIND TECH RES INST·Filed 2004·Application pending·0 cites
- 4131US5854130AMethod of forming multilevel interconnects in semiconductor devicesVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Dec 29, 1998·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →