Inventor · disambiguated record

Yi-Hsiu Chen

Also filed as: CHEN YI-HSIU · CHEN YI-HSIU E

48 granted patents·18 pending applications·1,008 citations·filing 2008–2025

97Inventor score

Technology areasH10W H10P H01L H10D B29K

Files withTAIWAN SEMICONDUCTOR MFG CO LTD41 WINBOND ELECTRONICS CORP8 EON SILICON SOLUTIONS INC3 UNITED MICROELECTRONICS CORP3 APPLE INC2

Top patents by PatentIndex Score

66 records

0198US11437480B2Forming a cavity with a wet etch for backside contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·5 cites·20 claims
0298US9425126B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·883 cites·20 claims
0396US11942527B2Forming a cavity with a wet etch for backside contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
0496US9893028B2Bond structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·13 cites·20 claims
0595US11817361B2Passivation structure with planar top surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
0695US10163623B1Etch method with surface modification treatment for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·14 cites·20 claims
0794US10636842B1Resistive random access memory and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·13 cites·20 claims
0891US10879214B2Die stack structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·8 cites·19 claims
0989US11699694B2Method of manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
1088US10867943B2Die structure, die stack structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·6 cites·20 claims
1188US9583465B1Three dimensional integrated circuit structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·6 cites·18 claims
1287US12272733B2Transistor device for source/drain backside contact and method of forming cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
1387US11502131B2Resistive random access memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 15, 2022·2 cites·15 claims
1487US10269741B2Bond structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·3 cites·20 claims
1586US10163709B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·4 cites·20 claims
1686US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
1785US10665582B2Method of manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·3 cites·20 claims
1884US9842823B2Chip-stacking apparatus having a transport device configured to transport a chip onto a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·7 cites·19 claims
1984US9601410B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·4 cites·20 claims
2083US9263382B2Through substrate via structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
2183US2025234583A1Forming a cavity with a wet etch for backside contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2281US12218022B2Passivation structure with planar top surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
2381US10600732B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·3 cites·20 claims
2481US10510604B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
2581US9754831B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·3 cites·20 claims
2681US2025140627A1Passivation structure with planar top surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2780US2025359287A1Self-aligned patterning layer for metal gate formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2880US2025357138A1Formation of self-assembled monolayer for selective etching processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2979US9972779B2Resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2015·Granted May 15, 2018·3 cites·8 claims
3077US10269761B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
3176US10593877B2Resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2018·Granted Mar 17, 2020·2 cites·18 claims
3275US9418933B2Through-substrate via formation with improved topography controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·2 cites·19 claims
3375US2024347506A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3473US2025349641A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3571US12489016B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
3671US12063796B2Manufacturing method of resistive random access memory deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
3770US12417924B2Formation of self-assembled monolayer for selective etching processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
3869US11043481B2Method of manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·0 cites·20 claims
3969US10672737B2Three-dimensional integrated circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·1 cites·20 claims
4068US9960349B2Resistive random-access memory structure and method for fabricating the sameWINBOND ELECTRONICS CORP·Filed 2017·Granted May 1, 2018·1 cites·16 claims
4166US12051672B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
4266US2025087543A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD HSINCHU·Filed 2024·Application pending·0 cites
4364US10510699B2Bond structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
4463US12506029B2Gap filling method in semiconductor manufacturing processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
4563US10170396B2Through via structure extending to metallization layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 1, 2019·1 cites·20 claims
4662US11688639B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 27, 2023·0 cites·20 claims
4760US2025275196A1Selective deposition method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4860US2024333490A1Physical unclonable function code generating apparatus and methodWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
4959US12015413B2Coding for pulse amplitude modulation with an odd number of output levelsAPPLE INC·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
5059US2025220945A1Selective deposition of gate dielectric layer of semiconductor device and the semiconductor device manufactured therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 66 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Yi-Hsiu Chen files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →