Inventor · disambiguated record
Yi-Hua Cheng
Also filed as: CHENG YI · Cheng yi-hua
4 granted patents·2 pending applications·2 citations·filing 2016–2025
58Inventor score
Top patents by PatentIndex Score
6 records- 0173US12288715B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 0268US2025218865A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0367US10373818B1Method of wafer recyclingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·2 cites·20 claims
- 0456US2025098259A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0550US11631612B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 0635US9548265B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Jan 17, 2017·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →