Inventor · disambiguated record
Yi Hsiao
Also filed as: HSIAO YI · HSIAO YI-LUN
3 granted patents·3 pending applications·1 citations·filing 2019–2023
48Inventor score
Top patents by PatentIndex Score
6 records- 0179US11227975B2Semiconductor structure having a bridge layerEPISTAR CORP·Filed 2019·Granted Jan 18, 2022·1 cites·20 claims
- 0265US2022102582A1Semiconductor structureEPISTAR CORP·Filed 2021·Application pending·0 cites
- 0353US12388221B2Electrical connector structureJESS LINK PRODUCTS CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·9 claims
- 0452US2023129560A1Semiconductor device and semiconductor component including the sameEPISTAR CORP·Filed 2022·Application pending·0 cites
- 0551US11227978B2Semiconductor device and package structureEPISTAR CORP·Filed 2019·Granted Jan 18, 2022·0 cites·19 claims
- 0647US2020365769A1Semiconductor deviceEPISTAR CORP·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yi Hsiao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →