Inventor · disambiguated record
Yi-Feng Hsu
Also filed as: HSU YI-FENG
1 granted patent·13 pending applications·3 citations·filing 2015–2025
22Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0177US2025286020A1Semiconductor bonding structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0277US2025286018A1Method of fabricating semiconductor bonding structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0377US2025286021A1Semiconductor packageUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0473US2025286019A1Semiconductor packageUNITED MICROELECTORNICS CORP·Filed 2025·Application pending·0 cites
- 0570US9502366B2Semiconductor structure with UBM layer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·3 cites·11 claims
- 0669US2024120316A1Semiconductor package, semiconductor bonding structure, and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 0759US2024413136A1Three-dimensional integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0856US2025266309A1Method for manufacturing semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0953US2024429093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1053US2025219031A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1152US2025300020A1Dicing method of semiconductor structure and semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1252US2024315095A1Micro display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1352US2024347503A1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1449US2024222204A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →