Inventor · disambiguated record
Yi-An Huang
Also filed as: HUANG YI · HUANG YI-AN
22 granted patents·1 pending application·26 citations·filing 2012–2023
92Inventor score
Top patents by PatentIndex Score
23 records- 0189US9953982B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·7 cites·11 claims
- 0285US10304178B2Method and system for diagnosing a semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 28, 2019·5 cites·20 claims
- 0379US10211211B1Method for fabricating buried word line of a dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·2 cites·6 claims
- 0477US9859123B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 0575US10312242B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·2 cites·9 claims
- 0673US12075613B2Buried word line of a dynamic random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 27, 2024·0 cites·11 claims
- 0773US11669957B2Semiconductor wafer measurement method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 0872US10374051B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·1 cites·11 claims
- 0972US9361198B1Detecting compromised resourcesGOOGLE INC·Filed 2012·Granted Jun 7, 2016·6 cites·26 claims
- 1070US11094057B2Semiconductor wafer measurement method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 1165US11799012B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 24, 2023·0 cites·9 claims
- 1263US11877433B2Storage node contact structure of a memory deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 16, 2024·0 cites·5 claims
- 1363US11222784B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 11, 2022·0 cites·2 claims
- 1459US10762621B2Semiconductor wafer measurement method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 1558US10804365B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 13, 2020·0 cites·10 claims
- 1658US2025017024A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1756US10756090B2Storage node contact structure of a memory device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·3 claims
- 1856US10651040B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 12, 2020·0 cites·14 claims
- 1954US11251187B2Buried word line of a dynamic random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 15, 2022·0 cites·9 claims
- 2054US9488489B2Personalized mapping with photo toursGOOGLE INC·Filed 2012·Granted Nov 8, 2016·1 cites·20 claims
- 2149US10276389B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·0 cites·19 claims
- 2248US11088023B2Method of forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 10, 2021·0 cites·14 claims
- 2348US10707214B2Fabricating method of cobalt silicide layer coupled to contact plugUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 7, 2020·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →