Inventor · disambiguated record
Yi Jiang
Also filed as: JIANG YI · JIANG YI-CHE
16 granted patents·6 pending applications·55 citations·filing 2013–2024
88Inventor score
Files withCHANGXIN MEMORY TECH INC11FORTUNE GOLD ENTPR LTD4CXMT CORP2MEDIATEK INC1SAINT GOBAIN PERFORMANCE PLASTICS CORP1
Top patents by PatentIndex Score
22 records- 0188US11854862B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 26, 2023·1 cites·7 claims
- 0283USD755116STireFORTUNE GOLD ENTPR LTD·Filed 2014·Granted May 3, 2016·30 cites·1 claims
- 0370USD754593STireFORTUNE GOLD ENTPR LTD·Filed 2014·Granted Apr 26, 2016·16 cites·1 claims
- 0464US12495539B2Semiconductor structure, method for manufacturing same, and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Dec 9, 2025·0 cites·12 claims
- 0564US2025081437A1Manufacturing method for and structure of a semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
- 0662US2025391768A1Semiconductor device and manufacturing method therefor, and dynamic random access memoryCXMT CORP·Filed 2024·Application pending·0 cites
- 0761US12309998B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0860US12446212B2Semiconductor structure, method for manufacturing same and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Oct 14, 2025·0 cites·18 claims
- 0959US12324141B2Memory and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 3, 2025·0 cites·15 claims
- 1059US12300744B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1158US12342534B2Method for fabricating a semiconductor structure with pillar array and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 24, 2025·0 cites·15 claims
- 1257US12369297B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 22, 2025·0 cites·14 claims
- 1357US2024155834A1Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1456US12446206B2Three-dimensional semiconductor structure and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 14, 2025·0 cites·14 claims
- 1554US2024387347A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1653US11755098B2Intelligent terminal energy saving method and device based on AI predictionSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 12, 2023·0 cites·16 claims
- 1753US2023021007A1Test structure and method for forming the same, and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 1852US10676828B2Conversion coating and method of makingSAINT GOBAIN PERFORMANCE PLASTICS CORP·Filed 2017·Granted Jun 9, 2020·0 cites·20 claims
- 1943USD756296STireFORTUNE GOLD ENTPR LTD·Filed 2014·Granted May 17, 2016·4 cites·1 claims
- 2043USD755713STireFORTUNE GOLD ENTPR LTD·Filed 2014·Granted May 10, 2016·4 cites·1 claims
- 2142US9182217B2Method for measuring displacement of large-range moving platformUNIV TSINGHUA·Filed 2013·Granted Nov 10, 2015·0 cites·5 claims
- 2242US2019248185A1Method of using corrugated zero-degree belt to manufacture tireShandong linglong tyre co ltd·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →