Inventor · disambiguated record
Yi-Fan Kao
Also filed as: KAO YI-FAN
5 granted patents·1 pending application·29 citations·filing 2009–2017
76Inventor score
Top patents by PatentIndex Score
6 records- 0189US9831167B1Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Nov 28, 2017·7 cites·18 claims
- 0288US9301405B1Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-holeKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Mar 29, 2016·10 cites·7 claims
- 0386US9439292B1Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·9 cites·10 claims
- 0475US9406641B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Aug 2, 2016·3 cites·8 claims
- 0546US9754870B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Sep 5, 2017·0 cites·4 claims
- 0643US2011061234A1Method For Fabricating Carrier Board Having No Conduction LineHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →