Inventor · disambiguated record
Yi-Yang Lei
Also filed as: LEI YI-YANG
24 granted patents·8 pending applications·65 citations·filing 2010–2025
93Inventor score
Top patents by PatentIndex Score
32 records- 0197US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0296US8258055B2Method of forming semiconductor dieHWANG CHIEN LING·Filed 2010·Granted Sep 4, 2012·38 cites·16 claims
- 0390US12051666B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·1 cites·20 claims
- 0489US11355466B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 0584US2025364303A1Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0682US10163849B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 0780US10522501B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 0878US2024339427A1Manufacturing method of package structure and package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0977US12441097B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 1075US12391033B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1175US10269747B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Apr 23, 2019·4 cites·21 claims
- 1274US11587902B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 21, 2023·1 cites·20 claims
- 1374US8501613B2UBM etching methods for eliminating undercutLEI YI-YANG·Filed 2011·Granted Aug 6, 2013·4 cites·12 claims
- 1474US8389397B2Method for reducing UBM undercut in metal bump structuresLEI YI-YANG·Filed 2010·Granted Mar 5, 2013·4 cites·19 claims
- 1574US2025300125A1Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1673US12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·14 claims
- 1772US12381176B2Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1870US11569183B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 1970US11069652B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 2070US2023115449A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2168US10790252B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·20 claims
- 2267US11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 2363US10535629B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 2462US11742317B2Process including a re-etching process for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 29, 2023·0 cites·20 claims
- 2560US10867939B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2658US2025079251A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2756US2024404932A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2854US9799625B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·20 claims
- 2953US2024371827A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3053US2024113032A1Packaged interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3148US11878388B2Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 23, 2024·0 cites·20 claims
- 3243US8748306B2Cleaning residual molding compound on solder bumpsLEI YI-YANG·Filed 2011·Granted Jun 10, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →