Inventor · disambiguated record
Yi-Han Liao
Also filed as: LIAO YI-HAN
8 granted patents·2 pending applications·14 citations·filing 2010–2024
81Inventor score
Files withUNITED MICROELECTRONICS CORP4TAIWAN SEMICONDUCTOR MFG CO LTD2UNIV NAT TAIWAN2HSU KUANG-YU1LIANG CHE WEI1
Top patents by PatentIndex Score
10 records- 0186US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0281US9153933B2Ti: sapphire crystal fiber, manufacturing method thereof, and wide band light source using the sameUNIV NAT TAIWAN·Filed 2013·Granted Oct 6, 2015·1 cites·13 claims
- 0379US9966263B1Method of fabricating fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·3 cites·16 claims
- 0476US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 0574US9444216B2Method of manufacturing a Ti:sapphire crystal fiber by laser-heated pedestal growthUNIV NAT TAIWAN·Filed 2013·Granted Sep 13, 2016·2 cites·9 claims
- 0662US8625948B2Ti: sapphire crystal fiber, manufacturing method thereof, and wide band light source using the sameHSU KUANG-YU·Filed 2010·Granted Jan 7, 2014·1 cites·4 claims
- 0758US2025323187A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024339467A1Zig-zag signal shielding for pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0953US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 1045US11164538B2Storage medium, expansion base and operation method thereof combined with portable electronic deviceLIANG CHE WEI·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →