Inventor · disambiguated record
Yi Lin
Also filed as: LIN YI · LIN YI-YUNG
2 granted patents·1 pending application·0 citations·filing 2003–2021
22Inventor score
Technology areasH10W
Files withASMPT SINGAPORE PTE LTD2
Top patents by PatentIndex Score
3 records- 0149US11955347B2Encapsulation process for double-sided cooled packagesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 0242US11621181B2Dual-sided molding for encapsulating electronic devicesASMPT SINGAPORE PTE LTD·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 0314US2004163795A1Heat sinkFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →