Inventor · disambiguated record

Yi-Nung Lin

Also filed as: LIN YI-NUNG

2 granted patents·2 citations·filing 2014–2019

33Inventor score

Technology areasH10P H10W

Files withKINSUS INTERCONNECT TECH CORP1 POWERCHIP SEMICONDUCTOR MFG CORP1

Top patents by PatentIndex Score

2 records

0162US10170403B2Ameliorated compound carrier board structure of flip-chip chip-scale packageKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jan 1, 2019·2 cites·8 claims
0238US11152370B2Memory structure having transistors and capacitor and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Oct 19, 2021·0 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →