Inventor · disambiguated record
Yi-Jung Liu
Also filed as: LIU YI · LIU YI-JUNG
5 granted patents·3 pending applications·9 citations·filing 2014–2024
70Inventor score
Files withINTEGRATED SILICON SOLUTION INC3ADVANTECH CO LTD1GLOBAL UNICHIP CORP1JCET GROUP CO LTD1TAIWAN SEMICONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
8 records- 0182US11612965B2Method of forming package structureINTEGRATED SILICON SOLUTION INC·Filed 2020·Granted Mar 28, 2023·2 cites·9 claims
- 0276US9282631B2Circuit with flat electromagnetic band gap resonance structureGLOBAL UNICHIP CORP·Filed 2014·Granted Mar 8, 2016·4 cites·10 claims
- 0373US9748175B1Conductive structure in semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·3 cites·20 claims
- 0468US2024301312A1Combustion-supporting package structureZHEJIANG TANFU NEW ENERGY CO LTD·Filed 2024·Application pending·0 cites
- 0566US11951571B2Method of forming package structureINTEGRATED SILICON SOLUTION INC·Filed 2023·Granted Apr 9, 2024·0 cites·6 claims
- 0645US2023275804A1Network connection method based on intelligent baseboard management controllerADVANTECH CO LTD·Filed 2022·Application pending·0 cites
- 0736US12033955B2Electromagnetic shielding package structure comprising electroplating layer and package method thereofJCET GROUP CO LTD·Filed 2019·Granted Jul 9, 2024·0 cites·10 claims
- 0835US2021305136A1Package structureINTEGRATED SILICON SOLUTION INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →