Inventor · disambiguated record
Yi-Jen Lo
Also filed as: LO YI-JEN
24 granted patents·14 pending applications·28 citations·filing 2005–2025
92Inventor score
Files withNANYA TECHNOLOGY CORP26MICRON TECHNOLOGY INC5INOTERA MEMORIES INC2TAIWAN SEMICONDUCTOR MFG CO LTD2HUNG CHIH-HSIUNG1
Top patents by PatentIndex Score
38 records- 0194US11876077B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Jan 16, 2024·3 cites·9 claims
- 0292US12457733B2Semiconductor device having bonding structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 28, 2025·1 cites·15 claims
- 0391US11842979B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 12, 2023·2 cites·5 claims
- 0489US9576933B1Fan-out wafer level packaging and manufacturing method thereofINOTERA MEMORIES INC·Filed 2016·Granted Feb 21, 2017·8 cites·11 claims
- 0588US12266622B2Method of manufacturing semiconductor structure having hybrid bonding padNANYA TECHNOLOGY CORP·Filed 2022·Granted Apr 1, 2025·1 cites·9 claims
- 0686US10818508B2Semiconductor structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Oct 27, 2020·4 cites·12 claims
- 0780US2025366103A1High-voltage semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025279322A1Electronic device, electronic structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0978US12295137B2Method of manufacturing tsemiconductor device having bonding structureNANYA TECHNOLOGY CORP·Filed 2023·Granted May 6, 2025·0 cites·13 claims
- 1078US2025234511A1Method of manufacturing semiconductor device having bonding structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1177US10811382B1Method of manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2019·Granted Oct 20, 2020·2 cites·15 claims
- 1277US2025343184A1Semiconductor structure having dummy conductive member and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1376US12278211B2Manufacturing method of semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 15, 2025·0 cites·7 claims
- 1476US9748106B2Method for fabricating semiconductor packageMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 29, 2017·2 cites·19 claims
- 1575US10593637B2Multi-device packages and related microelectronic devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·1 cites·22 claims
- 1674US2024105527A1Electronic device, electronic structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1773US2025183208A1Semiconductor structure having conductive pad with protrusion and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1872US9543270B1Multi-device package and manufacturing method thereofINOTERA MEMORIES INC·Filed 2015·Granted Jan 10, 2017·2 cites·20 claims
- 1972US2024063153A1Semiconductor structure having conductive pad with protrusion and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2072US2025273566A1Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2170US11211351B2Apparatuses including redistribution layers and related microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 2269US2024105526A1Electronic device, electronic structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2368US11631656B2Method for manufacturing semiconductor structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Apr 18, 2023·0 cites·9 claims
- 2466US12400951B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Aug 26, 2025·0 cites·8 claims
- 2562US10679958B2Methods of manufacturing a multi-device packageMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 2662US7341950B2Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layersINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 11, 2008·2 cites·39 claims
- 2761US2023420504A1High-voltage semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2859US11342307B2Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2019·Granted May 24, 2022·0 cites·9 claims
- 2956US12293982B2Semiconductor structure having hybrid bonding padNANYA TECHNOLOGY CORP·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 3055US11610878B1Semiconductor device with stacked chips and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 3154US11488840B2Wafer-to-wafer interconnection structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Nov 1, 2022·0 cites·10 claims
- 3254US11482474B2Forming a self-aligned TSV with narrow opening in horizontal isolation layer interfacing substrateNANYA TECHNOLOGY CORP·Filed 2020·Granted Oct 25, 2022·0 cites·17 claims
- 3352US10373922B2Methods of manufacturing a multi-device packageMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 6, 2019·0 cites·9 claims
- 3451US2010276764A1Semiconductor structure with selectively deposited tungsten film and method for making the sameLO YI-JEN·Filed 2009·Application pending·0 cites
- 3548US2010240214A1Method of forming multi metal layers thin film on waferNANYA TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 3647US2022165618A13d bonded semiconductor device and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 3745US8003528B2Semiconductor structure and method for making the sameNANYA TECHNOLOGY CORP·Filed 2010·Granted Aug 23, 2011·0 cites·10 claims
- 3831US2013249047A1Through silicon via structure and method for fabricating the sameHUNG CHIH-HSIUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →