Inventor · disambiguated record
Yii-Chian Lu
Also filed as: LU YII-CHIAN
6 granted patents·3 pending applications·58 citations·filing 1998–2025
80Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5UNITED MICROELECTRONICS CORP3TAIWAN SEMICONDUCTOR MFG CORP1
Top patents by PatentIndex Score
9 records- 0182US6879003B1Electrostatic discharge (ESD) protection MOS device and ESD circuitry thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 12, 2005·34 cites·25 claims
- 0278US2024371839A1Heat Dissipation in Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0378US2025349804A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0477US12074148B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 0570US7190030B1Electrostatic discharge protection structureUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 13, 2007·6 cites·18 claims
- 0668US11527518B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 0764US2023387078A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0859US7429774B2Electrostatic discharge (ESD) protection MOS device and ESD circuitry thereofUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 30, 2008·2 cites·22 claims
- 0955US6146968AMethod for forming a crown capacitorTAIWAN SEMICONDUCTOR MFG CORP·Filed 1998·Granted Nov 14, 2000·16 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →