Inventor · disambiguated record
Ying Ma
Also filed as: MA YING · MA YING LIANG
8 granted patents·2 pending applications·235 citations·filing 2001–2010
88Inventor score
Top patents by PatentIndex Score
10 records- 0192US6692546B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Feb 17, 2004·70 cites·39 claims
- 0290US6684917B2Apparatus for volumetric metering of small quantity of powder from fluidized bedsUNIV WESTERN ONTARIO·Filed 2001·Granted Feb 3, 2004·62 cites·82 claims
- 0389US7029373B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Apr 18, 2006·47 cites·40 claims
- 0487US6800218B2Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Oct 5, 2004·36 cites·36 claims
- 0576US7172770B2Mesoporous compositions for use in drug deliveryUNIV TEXAS·Filed 2002·Granted Feb 6, 2007·9 cites·13 claims
- 0673US7862848B2Direct coating solid dosage forms using powdered materialsUNIV WESTERN ONTARIO·Filed 2006·Granted Jan 4, 2011·8 cites·25 claims
- 0770US8161904B2Direct coating solid dosage forms using powdered materialsZHU JIANGXU·Filed 2010·Granted Apr 24, 2012·3 cites·22 claims
- 0859US7579014B2Mesoporous compositions for use in drug deliveryUNIV TEXAS·Filed 2006·Granted Aug 25, 2009·0 cites·15 claims
- 0948US2006160475A1Chemical mechanical polishing compositions for metal and associated materials and method of using sameMA YING·Filed 2006·Application pending·0 cites
- 1042US2005026437A1Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →