Inventor · disambiguated record
Ying-Te Ou
Also filed as: OU YING · OU YING-TE
18 granted patents·9 pending applications·64 citations·filing 2005–2020
92Inventor score
Files withADVANCED SEMICONDUCTOR ENG17CHIU CHI-TSUNG2HSU CHIH-JING2WANG YUNG-HUI2ADVANCED SEMINCONDUCTOR ENGINE1
Top patents by PatentIndex Score
27 records- 0188US8653634B2EMI-shielded semiconductor devices and methods of makingCHIU CHI TSUNG·Filed 2012·Granted Feb 18, 2014·13 cites·16 claims
- 0284US8841751B2Through silicon vias for semiconductor devices and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Sep 23, 2014·6 cites·20 claims
- 0381US7944707B2Package structure for connection with output/input moduleADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted May 17, 2011·10 cites·18 claims
- 0478US8963316B2Semiconductor device and method for manufacturing the sameHSU CHIH-JING·Filed 2012·Granted Feb 24, 2015·11 cites·16 claims
- 0577US11119524B1Glitch mitigation in selectable output current mirrors with degeneration resistorsCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2020·Granted Sep 14, 2021·2 cites·21 claims
- 0676US9711473B1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 18, 2017·2 cites·19 claims
- 0774US9253887B2Fabrication method of embedded chip substrateWANG YUNG-HUI·Filed 2012·Granted Feb 2, 2016·3 cites·7 claims
- 0870US8120148B2Package structure with embedded die and method of fabricating the sameCHEN KUO-HUA·Filed 2008·Granted Feb 21, 2012·5 cites·20 claims
- 0969US8937387B2Semiconductor device with conductive viasADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Jan 20, 2015·3 cites·16 claims
- 1069US8099865B2Method for manufacturing a circuit board having an embedded component thereinWANG YUNG HUI·Filed 2008·Granted Jan 24, 2012·5 cites·18 claims
- 1166US10600759B2Power and ground design for through-silicon via structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 24, 2020·1 cites·23 claims
- 1262US8350361B2Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive viaADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 8, 2013·1 cites·18 claims
- 1355US8222707B2Semiconductor package structure and package method thereofOU YING-TE·Filed 2009·Granted Jul 17, 2012·2 cites·15 claims
- 1453US9728451B2Through silicon vias for semiconductor devices and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 8, 2017·0 cites·20 claims
- 1553US2010018761A1Embedded chip substrate and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1652US9768103B2Fabrication method of embedded chip substrateADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 19, 2017·0 cites·8 claims
- 1749US11806710B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 7, 2023·0 cites·20 claims
- 1848US8486829B2Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive viaCHIU CHI-TSUNG·Filed 2012·Granted Jul 16, 2013·0 cites·6 claims
- 1948US2017287863A1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
- 2047US2010006330A1Structure and process of embedded chip packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 2144US2008180878A1Package structure with embedded capacitor, fabricating process thereof and applications of the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2244US2008164562A1Substrate with embedded passive element and methods for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2344US2008054450A1Chip package structure and heat sink for chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2440US2006283627A1Substrate structure of integrated embedded passive components and method for fabricating the sameADVANCED SEMINCONDUCTOR ENGINE·Filed 2005·Application pending·0 cites
- 2537US10236208B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 19, 2019·0 cites·17 claims
- 2635US2011127654A1Semiconductor Package and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 2728US2013134600A1Semiconductor device and method for manufacturing the sameHSU CHIH-JING·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →