Inventor · disambiguated record
Ying-Ching Shih
Also filed as: SHIH YING-CHING
139 granted patents·58 pending applications·970 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD173TAIWAN SEMICONDUCTOR MFG6IND TECH RES INST3SHIH YING-CHING3LIN JING-CHENG2
Top patents by PatentIndex Score
197 records- 0199US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0299US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0399US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 0498US11824040B2Package component, electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·5 cites·20 claims
- 0598US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 0698US11682645B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·4 cites·20 claims
- 0798US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 0898US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 0998US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 1098US8426961B2Embedded 3D interposer structureSHIH YING-CHING·Filed 2010·Granted Apr 23, 2013·188 cites·21 claims
- 1197US12033968B2Package structure including stacked pillar portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 9, 2024·2 cites·20 claims
- 1297US12033978B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·2 cites·20 claims
- 1397US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 1497US11456245B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 1597US11296032B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·5 cites·20 claims
- 1697US10529637B1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·17 cites·20 claims
- 1797US9570421B2Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·27 cites·20 claims
- 1896US11990351B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·3 cites·20 claims
- 1996US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 2096US9773755B2Substrate interconnections having different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·16 cites·20 claims
- 2195US11854877B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2295US11289424B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·11 cites·20 claims
- 2395US11139260B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·8 cites·20 claims
- 2495US9704825B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·11 cites·20 claims
- 2595US8664760B2Connector design for packaging integrated circuitsYU CHEN-HUA·Filed 2012·Granted Mar 4, 2014·18 cites·11 claims
- 2694US12230605B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·1 cites·20 claims
- 2794US11508692B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·3 cites·20 claims
- 2894US11410897B2Semiconductor structure having a dielectric layer edge covering circuit carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·7 cites·20 claims
- 2994US11075133B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·7 cites·20 claims
- 3094US10510684B2Three dimensional integrated circuit (3DIC) with support structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·8 cites·20 claims
- 3194US8581418B2Multi-die stacking using bumps with different sizesWU WENG-JIN·Filed 2010·Granted Nov 12, 2013·17 cites·20 claims
- 3294US7203426B2Optical subassembly of optical transceiverUNIV NAT TAIWAN·Filed 2005·Granted Apr 10, 2007·50 cites·27 claims
- 3393US12272568B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·1 cites·20 claims
- 3493US12119324B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 15, 2024·1 cites·20 claims
- 3593US11810831B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·1 cites·20 claims
- 3693US11164824B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·3 cites·20 claims
- 3793US10770365B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·6 cites·20 claims
- 3893US10290609B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·5 cites·20 claims
- 3993US9818697B2Semiconductor package manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·6 cites·20 claims
- 4093US9508666B2Packaging structures and methods with a metal pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·13 cites·17 claims
- 4193US9142533B2Substrate interconnections having different sizesShen wen-wei·Filed 2010·Granted Sep 22, 2015·18 cites·19 claims
- 4292US11967546B2Giga interposer integration through Chip-On-Wafer-On-SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
- 4392US10804178B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·5 cites·20 claims
- 4492US10756058B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·5 cites·18 claims
- 4592US10269589B2Method of manufacturing a release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 4692US7541217B1Stacked chip structure and fabrication method thereofIND TECH RES INST·Filed 2008·Granted Jun 2, 2009·24 cites·13 claims
- 4791US12183681B2Package structure having bridge structure for connection between semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 31, 2024·2 cites·20 claims
- 4891US11600595B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·2 cites·20 claims
- 4991US10916450B2Package of integrated circuits having a light-to-heat-conversion coating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·6 cites·19 claims
- 5090US11749607B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·1 cites·20 claims
Showing the top 50 of 197 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →