Inventor · disambiguated record
Yi-Sheng Anthony Sun
Also filed as: SUN YI · SUN YI SHENG ANTHONY · SUN YI-SHENG · SUN YI-SHENG A
22 granted patents·3 pending applications·284 citations·filing 2003–2021
95Inventor score
Files withMAXIM INTEGRATED PRODUCTS7UNITED TEST & ASSEMBLY CT LTD4UNITED TEST & ASSEMBLY CT LT3TOH CHIN HOCK2UNIV ZHEJIANG2
Top patents by PatentIndex Score
25 records- 0197US9704726B2Packaging structural memberUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Jul 11, 2017·35 cites·19 claims
- 0297US9142487B2Packaging structural memberUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Sep 22, 2015·44 cites·20 claims
- 0396US8384203B2Packaging structural memberUNITED TEST & ASSEMBLY CT LT·Filed 2009·Granted Feb 26, 2013·50 cites·20 claims
- 0493US8643150B1Wafer-level package device having solder bump assemblies that include an inner pillar structureXU YONG L·Filed 2012·Granted Feb 4, 2014·27 cites·10 claims
- 0593US8575493B1Integrated circuit device having extended under ball metallizationXU YONG LI·Filed 2011·Granted Nov 5, 2013·41 cites·8 claims
- 0691US9087732B1Wafer-level package device having solder bump assemblies that include an inner pillar structureMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jul 21, 2015·11 cites·9 claims
- 0786US7339278B2Cavity chip packageUNITED TEST & ASSEMBLY CT LTD·Filed 2006·Granted Mar 4, 2008·21 cites·23 claims
- 0880US9583425B2Solder fatigue arrest for wafer level packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 28, 2017·6 cites·8 claims
- 0980US8686543B23D chip package with shielded structuresBERGEMONT ALBERT·Filed 2011·Granted Apr 1, 2014·7 cites·20 claims
- 1078US9397027B1Sacrificial pad on semiconductor package device and methodMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jul 19, 2016·5 cites·19 claims
- 1178US8586465B2Through silicon via dies and packagesLIU HAO·Filed 2008·Granted Nov 19, 2013·7 cites·15 claims
- 1277US8647924B2Semiconductor package and method of packaging semiconductor devicesTOH CHIN HOCK·Filed 2010·Granted Feb 11, 2014·8 cites·23 claims
- 1375US9093333B1Integrated circuit device having extended under ball metallizationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Jul 28, 2015·3 cites·6 claims
- 1475US8741762B2Through silicon via dies and packagesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jun 3, 2014·3 cites·21 claims
- 1572US9425160B1Wafer-level package device with solder bump reinforcementMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 23, 2016·3 cites·10 claims
- 1669US10727086B2Optical sensor packaging systemMAXIM INTEGRATED PRODUCTS·Filed 2019·Granted Jul 28, 2020·1 cites·10 claims
- 1765US8772921B2Interposer for semiconductor packageTOH CHIN HOCK·Filed 2012·Granted Jul 8, 2014·2 cites·20 claims
- 1859US11380558B2Optical sensor packaging systemMAXIM INTEGRATED PRODUCTS·Filed 2020·Granted Jul 5, 2022·0 cites·22 claims
- 1957US12196948B2Electrostatic comb drive-based silicon-based MEMS optical switch and N × N arrayUNIV ZHEJIANG·Filed 2021·Granted Jan 14, 2025·0 cites·10 claims
- 2052US7851899B2Multi-chip ball grid array package and method of manufactureUTAC UNITED TEST AND ASSEMBLY TEST CT LTD·Filed 2004·Granted Dec 14, 2010·10 cites·14 claims
- 2143US2009236726A1Package-on-package semiconductor structureUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
- 2240US11598921B2Ultra-broadband silicon waveguide micro-electro-mechanical systems (MEMS) photonic switchUNIV ZHEJIANG·Filed 2020·Granted Mar 7, 2023·0 cites·8 claims
- 2339US9343430B2Stacked wafer-level package deviceSAMOILOV ARKADII V·Filed 2011·Granted May 17, 2016·0 cites·19 claims
- 2436US2004140557A1Wl-bga for MEMS/MOEMS devicesUNITED TEST & ASSEMBLY CT LTD·Filed 2003·Application pending·0 cites
- 2536US2004140475A13D MEMS/MOEMS packageUNITED TEST & ASSEMBLY CT LTD·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yi-Sheng Anthony Sun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →