Inventor · disambiguated record
Yiyang Wan
Also filed as: WAN YIYANG
1 granted patent·11 pending applications·0 citations·filing 2020–2025
9Inventor score
Files withAPPLIED MATERIALS INC12
Top patents by PatentIndex Score
12 records- 0165US2025372449A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0265US2025372448A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0365US2025372450A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0464US2025376762A1Cyclic plasma and thermal process to improve pecvd ti silicide deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0561US2025379031A1Tuning deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0655US2024068096A1Showerhead Assembly with Heated ShowerheadAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0753US2025112091A1Surface treatment enabling super-conformal metal cap profile on middle of-line (mol) silicidesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0851US2025054767A1Selective metal capping processes for a junction silicideAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0950US2025054812A1Selective bottom-up metal fill/cap on junction silicide by selective metal removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1050US2025079239A1Selective capping for gate-all-around field effect transistorsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1146US11664229B2Nitride capping of titanium material to improve barrier propertiesAPPLIED MATERIALS INC·Filed 2020·Granted May 30, 2023·0 cites·18 claims
- 1246US2023377892A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →