Inventor · disambiguated record
Yi-Chieh Wang
Also filed as: WANG YI · WANG YI-CHIEH
13 granted patents·5 pending applications·43 citations·filing 2007–2024
88Inventor score
Files withUNITED MICROELECTRONICS CORP4LYTONE ENTERPRISE INC3SILICONWARE PRECISION INDUSTRIES CO LTD2TAIWAN SEMICONDUCTOR MFG CO LTD2WHANG TSUNG CHUAN2
Top patents by PatentIndex Score
18 records- 0185US8461086B2Microcapsule composition for inhibiting an ethylene response in plants, method for preparing microcapsules, and method using the microcapsule compositionCHANG WILLIAM T H·Filed 2009·Granted Jun 11, 2013·23 cites·16 claims
- 0283US9349610B2Assembly structure for connecting multiple dies into a system-in-package chip and the method thereofWHANG TSUNG CHUAN·Filed 2015·Granted May 24, 2016·5 cites·10 claims
- 0381US9111846B1Assembly structure for connecting multiple dies into a system-in-package chip and the method thereofWHANG TSUNG CHUAN·Filed 2014·Granted Aug 18, 2015·6 cites·15 claims
- 0475US11804526B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·1 claims
- 0575US11798998B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 24, 2023·0 cites·1 claims
- 0675US11791386B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 17, 2023·0 cites·9 claims
- 0775US8372392B2Lactobacillus paracasei strain LT12 as immunity regulatory agentLYTONE ENTERPRISE INC·Filed 2009·Granted Feb 12, 2013·5 cites·5 claims
- 0872US11462621B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 4, 2022·0 cites·19 claims
- 0972US9460957B2Method and structure for nitrogen-doped shallow-trench isolation dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 4, 2016·3 cites·18 claims
- 1059US2025087635A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1158US8957825B2Decoupling circuit and antenna deviceWISTRON NEWEB CORP·Filed 2013·Granted Feb 17, 2015·1 cites·20 claims
- 1252US11637399B2Connector combination structure and connector thereofWISTRON NEWEB CORP·Filed 2021·Granted Apr 25, 2023·0 cites·16 claims
- 1351US2024266335A1Electronic package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1450US2020184299A1Card-making substrate and preparation method thereof and ic card or electronic tag containing the sameTIANJIN BOYUAN NEW MAT CO LTD·Filed 2019·Application pending·0 cites
- 1548US10804083B2Cathode assembly, physical vapor deposition system, and method for physical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 13, 2020·0 cites·20 claims
- 1647US2009105160A1Pharmaceutical composition, package and method for rapidly reducing the uric acid in bloodLYTONE ENTERPRISE INC·Filed 2007·Application pending·0 cites
- 1739US9059509B2Decoupling circuit and antenna deviceCHEN I-SHAN·Filed 2012·Granted Jun 16, 2015·0 cites·18 claims
- 1836US2010317584A1Pharmaceutical composition, package and method for rapidly reducing the uric acid in bloodLYTONE ENTERPRISE INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →