Inventor · disambiguated record
Yiheng Xu
Also filed as: XU YIHENG
48 granted patents·6 pending applications·166 citations·filing 2007–2022
97Inventor score
Top patents by PatentIndex Score
54 records- 0193US9337087B1Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the sameST MICROELECTRONICS INC·Filed 2014·Granted May 10, 2016·13 cites·16 claims
- 0293US8859350B2Recessed gate field effect transistorST MICROELECTRONICS INC·Filed 2014·Granted Oct 14, 2014·13 cites·19 claims
- 0393US8829670B1Through silicon via structure for internal chip coolingST MICROELECTRONICS INC·Filed 2013·Granted Sep 9, 2014·17 cites·18 claims
- 0492US9412654B1Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating stepIBM·Filed 2015·Granted Aug 9, 2016·9 cites·20 claims
- 0592US8921976B2Using backside passive elements for multilevel 3D wafers alignment applicationsZHANG JOHN H·Filed 2011·Granted Dec 30, 2014·14 cites·13 claims
- 0692US8680577B2Recessed gate field effect transistorZHANG JOHN H·Filed 2012·Granted Mar 25, 2014·13 cites·9 claims
- 0789US9984933B1Silicon liner for STI CMP stop in FinFETGLOBALFOUNDRIES INC·Filed 2017·Granted May 29, 2018·7 cites·20 claims
- 0888US10211045B1Microwave annealing of flowable oxides with trap layersGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 19, 2019·5 cites·20 claims
- 0987US9496415B1Structure and process for overturned thin film device with self-aligned gate and S/D contactsIBM·Filed 2015·Granted Nov 15, 2016·4 cites·9 claims
- 1087US9391020B2Interconnect structure having large self-aligned viasST MICROELECTRONICS INC·Filed 2014·Granted Jul 12, 2016·7 cites·18 claims
- 1187US9240375B2Modular fuses and antifuses for integrated circuitsST MICROELECTRONICS INC·Filed 2013·Granted Jan 19, 2016·7 cites·11 claims
- 1286US8685850B2System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnectionsZHANG JOHN H·Filed 2012·Granted Apr 1, 2014·7 cites·8 claims
- 1384US9837394B2Self-aligned three dimensional chip stack and method for making the sameIBM·Filed 2015·Granted Dec 5, 2017·3 cites·10 claims
- 1483US10950722B2Vertical gate all-around transistorST MICROELECTRONICS INC·Filed 2014·Granted Mar 16, 2021·6 cites·19 claims
- 1583US9646939B2Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the sameIBM·Filed 2016·Granted May 9, 2017·3 cites·20 claims
- 1682US10790198B2Fin structuresGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 29, 2020·3 cites·10 claims
- 1782US8900990B2System and method of combining damascenes and subtract metal etch for advanced back end of line interconnectionsST MICROELECTRONICS INC·Filed 2012·Granted Dec 2, 2014·6 cites·11 claims
- 1881US9659820B2Interconnect structure having large self-aligned viasIBM·Filed 2016·Granted May 23, 2017·3 cites·9 claims
- 1980US9214429B2Trench interconnect having reduced fringe capacitanceST MICROELECTRONICS INC·Filed 2013·Granted Dec 15, 2015·5 cites·20 claims
- 2078US9373561B1Integrated circuit barrierless microfluidic channelIBM·Filed 2014·Granted Jun 21, 2016·3 cites·10 claims
- 2177US10361289B1Gate oxide formation through hybrid methods of thermal and deposition processes and method for producing the sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 23, 2019·2 cites·18 claims
- 2277US9362230B1Methods to form conductive thin film structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 7, 2016·2 cites·20 claims
- 2374US10304815B2Self-aligned three dimensional chip stack and method for making the sameIBM·Filed 2017·Granted May 28, 2019·1 cites·11 claims
- 2473US9385177B2Technique for fabrication of microelectronic capacitors and resistorsST MICROELECTRONICS INC·Filed 2013·Granted Jul 5, 2016·2 cites·13 claims
- 2571US10026849B2Structure and process for overturned thin film device with self-aligned gate and S/D contactsIBM·Filed 2016·Granted Jul 17, 2018·1 cites·8 claims
- 2669US8623673B1Structure and method for detecting defects in BEOL processingDYER THOMAS W·Filed 2012·Granted Jan 7, 2014·2 cites·13 claims
- 2768US10832965B2Fin reveal forming STI regions having convex shape between finsGLOBALFOUNDRIES INC·Filed 2018·Granted Nov 10, 2020·1 cites·14 claims
- 2866US9905511B2Modular fuses and antifuses for integrated circuitsST MICROELECTRONICS INC·Filed 2015·Granted Feb 27, 2018·1 cites·20 claims
- 2964US9082625B2Patterning through imprintingIBM·Filed 2013·Granted Jul 14, 2015·1 cites·21 claims
- 3064US8026166B2Interconnect structures comprising capping layers with low dielectric constants and methods of making the sameIBM·Filed 2008·Granted Sep 27, 2011·3 cites·7 claims
- 3159US10700214B2Overturned thin film device with self-aligned gate and source/drain (S/D) contactsIBM·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 3258US10388639B2Self-aligned three dimensional chip stack and method for making the sameIBM·Filed 2017·Granted Aug 20, 2019·0 cites·11 claims
- 3358US10347617B2Self-aligned three dimensional chip stack and method for making the sameIBM·Filed 2017·Granted Jul 9, 2019·0 cites·11 claims
- 3457US10546743B2Advanced interconnect with air gapST MICROELECTRONICS INC·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 3557US9018097B2Semiconductor device processing with reduced wiring puddle formationIBM·Filed 2012·Granted Apr 28, 2015·1 cites·13 claims
- 3654US9502325B2Integrated circuit barrierless microfluidic channelIBM·Filed 2016·Granted Nov 22, 2016·0 cites·1 claims
- 3754US9209036B2Method for controlling the profile of an etched metallic layerIBM·Filed 2014·Granted Dec 8, 2015·0 cites·12 claims
- 3852US9385062B1Integrated circuit barrierless microfluidic channelIBM·Filed 2016·Granted Jul 5, 2016·0 cites·1 claims
- 3952US2015162277A1Advanced interconnect with air gapIBM·Filed 2013·Application pending·0 cites
- 4051US7570174B2Real time alarm classification and method of useIBM·Filed 2007·Granted Aug 4, 2009·1 cites·2 claims
- 4150US9658523B2Interconnect structure having large self-aligned viasST MICROELECTRONICS INC·Filed 2014·Granted May 23, 2017·0 cites·14 claims
- 4250US9633986B2Technique for fabrication of microelectronic capacitors and resistorsIBM·Filed 2016·Granted Apr 25, 2017·0 cites·20 claims
- 4350US9324793B2Method for controlling the profile of an etched metallic layerIBM·Filed 2015·Granted Apr 26, 2016·0 cites·17 claims
- 4449US2024265206A1Reading order detection in a documentMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Application pending·0 cites
- 4548US9786551B2Trench structure for high performance interconnection lines of different resistivity and method of making sameST MICROELECTRONICS INC·Filed 2014·Granted Oct 10, 2017·0 cites·23 claims
- 4648US8970004B2Electrostatic discharge devices for integrated circuitsST MICROELECTRONICS INC·Filed 2012·Granted Mar 3, 2015·0 cites·18 claims
- 4746US9018092B2Encapsulated metal interconnectST MICROELECTRONICS INC·Filed 2012·Granted Apr 28, 2015·0 cites·13 claims
- 4846US8889506B1Structure and method for interconnect spatial frequency doubling using selective ridgesST MICROELECTRONICS INC·Filed 2013·Granted Nov 18, 2014·0 cites·20 claims
- 4946US8395228B2Integration process to improve focus leveling within a lot process variationLI WAI-KIN·Filed 2010·Granted Mar 12, 2013·0 cites·31 claims
- 5044US10319630B2Encapsulated damascene interconnect structure for integrated circuitsST MICROELECTRONICS INC·Filed 2012·Granted Jun 11, 2019·0 cites·19 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →