Inventor · disambiguated record
Yi Xu
Also filed as: XU YI · XU YI-QIANG
6 granted patents·9 pending applications·21 citations·filing 1997–2024
73Inventor score
Files withSHENZHEN FUTAIHONG PREC IND CO7UNIV DALIAN TECH5APPLIED MATERIALS INC1CHARTERED SEMICONDUCTOR MFG1UNIV CITY HONG KONG1
Top patents by PatentIndex Score
15 records- 0188US11229939B1Method for manufacturing curved thin-walled intermetallic compound component by winding mandrel with metal foil stripsUNIV DALIAN TECH·Filed 2021·Granted Jan 25, 2022·1 cites·1 claims
- 0282US10612152B2Method of fabricating nanoporous metal structureUNIV CITY HONG KONG·Filed 2016·Granted Apr 7, 2020·3 cites·10 claims
- 0367US2009268384A1Housing, electronic device using the housing, and manufacturing method thereofSHENZHEN FUTAIHONG PREC IND CO·Filed 2009·Application pending·0 cites
- 0459US2009280306A1Housing and method for making the sameSHENZHEN FUTAIHONG PREC IND CO·Filed 2009·Application pending·0 cites
- 0558US11612960B2Method for preparing thin-walled preforms by laser metal deposition and follow-up rollingUNIV DALIAN TECH·Filed 2022·Granted Mar 28, 2023·0 cites·3 claims
- 0657US2024359225A1Integral forming method for large-size thin-walled ring shellUNIV DALIAN TECH·Filed 2024·Application pending·0 cites
- 0756US2009301748A1Housing, electronic device using the housing, and manufacturing method thereofSHENZHEN FUTAIHONG PREC IND CO·Filed 2009·Application pending·0 cites
- 0850US11292057B2Method for manufacturing thin-walled metal component by three- dimensional printing and hot gas bulgingUNIV DALIAN TECH·Filed 2020·Granted Apr 5, 2022·0 cites·7 claims
- 0950US2024204061A1Method of reducing metal gate resistance for next generation nmos device applicationAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1050US2009045533A1Mold for making a housing and method for making the housingSHENZHEN FUTAIHONG PREC IND CO·Filed 2007·Application pending·0 cites
- 1149US2009280281A1Housing and method for making the sameSHENZHEN FUTAIHONG PREC IND CO·Filed 2009·Application pending·0 cites
- 1249US2009269556A1Housing, electronic device using the housing, and manufacturing method thereofSHENZHEN FUTAIHONG PREC IND CO·Filed 2009·Application pending·0 cites
- 1348US11207732B2Integrated method for manufacturing high-temperature resistant thin-walled component by preforming by laying metal foil stripUNIV DALIAN TECH·Filed 2020·Granted Dec 28, 2021·0 cites·3 claims
- 1447US5930677AMethod for reducing microloading in an etchback of spin-on-glass or polymerCHARTERED SEMICONDUCTOR MFG·Filed 1997·Granted Jul 27, 1999·17 cites·29 claims
- 1543US2008003412A1Cover for a mobile device and method for making the coverSHENZHEN FUTAIHONG PREC IND CO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →