Inventor · disambiguated record
Yingqiang Yan
Also filed as: YAN YINGQIANG
4 granted patents·12 pending applications·0 citations·filing 2018–2025
51Inventor score
Technology areasH10W
Files withINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES12SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP2GUANGDONG INST SEMICONDUCTOR INDUSTRIAL TECH1SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD1
Top patents by PatentIndex Score
16 records- 0156US12506252B2Fan-out package structure and fabrication method thereforINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0256US2025157971A1Three-dimensional chip stack preparing method and three-dimensional chip stacking structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0356US2025192091A1Fan-out package structure and fan-out package methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0451US2024234328A9Multi-chip interconnection package structure with heat dissipation plate and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0551US2024304556A1Chiplet-fine-interconnection-package structure and method of manufacturing the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0648US2024186254A1Carrier structure suitable for chiplet fine line and manufacturing method thereof, and fine line chiplet packaging structure and manufacturing method of the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0748US2025246533A1Fan-out package structure with inter-chip fine internal interconnection line and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Application pending·0 cites
- 0846US12184253B2Filter radio frequency module packaging structure and method for manufacturing sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 0944US2023245944A1Fan-out type package preparation method of fan-out type packageINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1043US2025336873A1Back-to-back three-dimensional stacked fan-out packaging structure and preparation method thereof, back-to-back three-dimensional stacked fan-out packaging module and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 1141US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 1241US2025300059A1Double-sided stacked fan-out package device and fabrication method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 1340US2022149007A1Chip packaging structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2020·Application pending·0 cites
- 1432US11784625B2Packaging method and package structure for filter chipGUANGDONG INST SEMICONDUCTOR INDUSTRIAL TECH·Filed 2019·Granted Oct 10, 2023·0 cites·9 claims
- 1528US11710646B2Fan-out packaging method and fan-out packaging plateSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Granted Jul 25, 2023·0 cites·15 claims
- 1626US2021358883A1Fan-out packaging method employing combined processSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yingqiang Yan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →