Inventor · disambiguated record
Yi-Liang Ye
Also filed as: YE YI · YE YI-LIANG
17 granted patents·2 pending applications·22 citations·filing 2015–2023
89Inventor score
Top patents by PatentIndex Score
19 records- 0189US10332981B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 25, 2019·5 cites·7 claims
- 0285US10312084B2Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·3 cites·8 claims
- 0381US9960084B1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 1, 2018·3 cites·11 claims
- 0480US10446667B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 15, 2019·2 cites·11 claims
- 0578US10796943B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·12 claims
- 0676US9793105B1Fabricating method of fin field effect transistor (FinFET)UNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 0776US9613808B1Method of forming multilayer hard mask with treatment for removing impurities and forming dangling bondsUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 4, 2017·2 cites·7 claims
- 0875US9748111B2Method of fabricating semiconductor structure using planarization process and cleaning processUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·2 cites·18 claims
- 0969US9627534B1Semiconductor MOS device having a dense oxide film on a spacerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·1 cites·12 claims
- 1067US2025129230A1Methods for purifying a reclaimed polymerDOW GLOBAL TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1167US2025115730A1Methods for purifying a reclaimed polymerDOW GLOBAL TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1260US10651174B2FinFET structure and fabricating method of gate structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 12, 2020·0 cites·5 claims
- 1350US10340268B2FinFET structure and fabricating method of gate structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 2, 2019·0 cites·6 claims
- 1449US10622481B2Method of rounding corners of a finUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·9 claims
- 1546US10892348B2Method of rounding fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 12, 2021·0 cites·13 claims
- 1643US10332741B2Method for post chemical mechanical polishing cleanUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·0 cites·3 claims
- 1742US9899520B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 20, 2018·0 cites·15 claims
- 1841US9570315B2Method of interfacial oxide layer formation in semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·0 cites·18 claims
- 1938US9966266B2Apparatus for semiconductor wafer treatment and semiconductor wafer treatmentUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →