Inventor · disambiguated record
Younes Boutaleb
Also filed as: BOUTALEB YOUNES
3 granted patents·16 pending applications·1 citations·filing 2021–2025
48Inventor score
Files withST MICROELECTRONICS GRENOBLE 214ST MICROELECTRONICS INT NV3STMICROELECTRNOICS ALPS SAS1STMICROELECTRONCIS GRENOBLE 2 SAS1
Top patents by PatentIndex Score
19 records- 0177US12278155B2Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 15, 2025·1 cites·18 claims
- 0260US2025218884A1Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2025·Application pending·0 cites
- 0356US2025142991A1Optical package comprising a coating between an optical element and an electronic chipST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0454US2024168245A1Integrated circuit comprising an assembly of an electronic chip, an optical element and a substrate and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0553US2024047407A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0653US2024079363A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0753US2023403791A1Package, for example an optical package, for an integrated circuitST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0852US2024162259A1Chip package and its method of fabricationST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0951US2023266441A1Time-of-flight sensorST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1050US11656121B2Optical package of an integrated circuitST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted May 23, 2023·0 cites·19 claims
- 1150US2025273530A1Thermally enhanced electro-optical deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1249US2023140705A1Cooling of an electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1349US2023069969A1Package for several integrated circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1449US2023137239A1Cooling of an electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1548US2022392820A1Integrated circuit optical packageST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1647US2024153880A1Qfn package comprising two electronic chips with different substratesSTMICROELECTRONCIS GRENOBLE 2 SAS·Filed 2023·Application pending·0 cites
- 1747US2023060870A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1838US12292607B2Optical packageSTMICROELECTRNOICS ALPS SAS·Filed 2022·Granted May 6, 2025·0 cites·22 claims
- 1938US2025239496A1Integrated circuit packageST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →