Inventor · disambiguated record
Yong Poo Chia
Also filed as: CHIA YONG POO
58 granted patents·5 pending applications·1,183 citations·filing 2002–2024
99Inventor score
Top patents by PatentIndex Score
63 records- 0199US7855462B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 21, 2010·148 cites·23 claims
- 0298US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0397US8723307B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameJIANG TONGBI·Filed 2010·Granted May 13, 2014·37 cites·22 claims
- 0497US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0596US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0694US8106488B2Wafer level packagingCHUA SWEE KWANG·Filed 2010·Granted Jan 31, 2012·18 cites·18 claims
- 0794US7791203B2Interconnects for packaged semiconductor devices and methods for manufacturing such devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 7, 2010·26 cites·18 claims
- 0894US7633159B2Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·26 cites·27 claims
- 0993US11594525B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 28, 2023·1 cites·27 claims
- 1093US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 1193US7820484B2Wafer level packagingMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·20 cites·48 claims
- 1293US7208335B2Castellated chip-scale packages and methods for fabricating the sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 24, 2007·62 cites·72 claims
- 1392US7375009B2Method of forming a conductive via through a waferMICRON TECHNOLOGY INC·Filed 2002·Granted May 20, 2008·51 cites·35 claims
- 1492US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 1591US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 1690US7843050B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 30, 2010·12 cites·18 claims
- 1790US7674655B2Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding materialMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·15 cites·24 claims
- 1890US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1990US2024421131A1Packaged integrated circuit devices with through-body conductive vias, and methods of making sameLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2089US9099571B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 4, 2015·5 cites·21 claims
- 2187US10431531B2Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·3 cites·19 claims
- 2287US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 2387US7274094B2Leadless packaging for image sensor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 25, 2007·39 cites·24 claims
- 2486US9165910B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 20, 2015·4 cites·18 claims
- 2586US7712211B2Method for packaging circuits and packaged circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·26 cites·25 claims
- 2686US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 2785US7579681B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 25, 2009·28 cites·21 claims
- 2884US12087738B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Sep 10, 2024·0 cites·18 claims
- 2984US7884007B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·8 cites·22 claims
- 3084US7368374B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2004·Granted May 6, 2008·24 cites·36 claims
- 3184US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 3283US10593653B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2015·Granted Mar 17, 2020·2 cites·7 claims
- 3383US8063493B2Semiconductor device assemblies and packagesBOON SUAN JEUNG·Filed 2009·Granted Nov 22, 2011·9 cites·20 claims
- 3482US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 3581US7112471B2Leadless packaging for image sensor devices and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·27 cites·26 claims
- 3679US9679834B2Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Jun 13, 2017·2 cites·17 claims
- 3779US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 3879US8232657B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 3979US8198720B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2010·Granted Jun 12, 2012·3 cites·11 claims
- 4079US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 4178US8564106B2Wafer level packagingCHUA SWEE KWANG·Filed 2012·Granted Oct 22, 2013·3 cites·20 claims
- 4277US9911696B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 6, 2018·2 cites·18 claims
- 4377US8525320B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2011·Granted Sep 3, 2013·4 cites·18 claims
- 4476US2022013460A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 4574US11398457B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 4673US9653444B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted May 16, 2017·1 cites·14 claims
- 4772US7659134B2Microelectronic imagers and methods for manufacturing such microelectronic imagersAPTINA IMAGING CORP·Filed 2007·Granted Feb 9, 2010·5 cites·20 claims
- 4872US2020243444A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 4971US8906744B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 9, 2014·1 cites·18 claims
- 5069US8536702B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2012·Granted Sep 17, 2013·1 cites·13 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →