Inventor · disambiguated record
Yoshinori Deguchi
Also filed as: DEGUCHI YOSHINORI
22 granted patents·3 pending applications·198 citations·filing 1998–2021
95Inventor score
Top patents by PatentIndex Score
25 records- 0189US6633176B2Semiconductor device test probe having improved tip portion and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 14, 2003·47 cites·7 claims
- 0288US9053954B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 9, 2015·8 cites·20 claims
- 0386US7276923B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Oct 2, 2007·12 cites·4 claims
- 0485US8896129B2Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 25, 2014·5 cites·15 claims
- 0583US7423439B2Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 9, 2008·12 cites·18 claims
- 0682US9490218B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·3 cites·16 claims
- 0782US7274195B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 25, 2007·26 cites·4 claims
- 0881US10777507B2Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 15, 2020·3 cites·17 claims
- 0980US9171767B2Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 27, 2015·3 cites·15 claims
- 1077US11387172B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jul 12, 2022·3 cites·18 claims
- 1176US8178981B2Semiconductor deviceKANZAKI TERUAKI·Filed 2010·Granted May 15, 2012·5 cites·11 claims
- 1273US7701063B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Apr 20, 2010·5 cites·3 claims
- 1373US6356096B2Test board for testing a semiconductor device utilizing first and second delay elements in a signal-transmission-pathMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 12, 2002·35 cites·8 claims
- 1470US9825017B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·1 cites·19 claims
- 1570US9230938B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 5, 2016·2 cites·10 claims
- 1670US7534629B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted May 19, 2009·4 cites·24 claims
- 1768US8945953B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 3, 2015·2 cites·17 claims
- 1867US6727714B2Probe cardRENESAS TECH CORP·Filed 2002·Granted Apr 27, 2004·13 cites·3 claims
- 1961US6628127B2Probe card for testing semiconductor integrated circuit and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 30, 2003·9 cites·12 claims
- 2060US10818601B1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 27, 2020·0 cites·17 claims
- 2156US10141295B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·0 cites·11 claims
- 2250US2016027731A1Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2345US11456264B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2021·Granted Sep 27, 2022·0 cites·15 claims
- 2443US2020043877A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2537US2005007134A1Probe cardRENESAS TECH CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshinori Deguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →