Inventor · disambiguated record
Yong Du
Also filed as: DU YONG · DU YONG HYEUNG
15 granted patents·11 pending applications·90 citations·filing 2000–2024
91Inventor score
Files withMICRON TECHNOLOGY INC5UNIV JOHNS HOPKINS5VERTICAL CIRCUITS INC3DU YONG2NAJING TECH CORP LTD2
Top patents by PatentIndex Score
26 records- 0194US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0292US9457421B2Wire-bonding apparatus and method of wire bondingSHINKAWA KK·Filed 2015·Granted Oct 4, 2016·7 cites·9 claims
- 0378US12165036B2Methods and related aspects for pathology prognosisUNIV JOHNS HOPKINS·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0478US2024370700A1Methods and related aspects for pathology prognosisUNIV JOHNS HOPKINS·Filed 2024·Application pending·0 cites
- 0574US7163839B2Multi-chip module and method of manufactureSPANSION LLC·Filed 2005·Granted Jan 16, 2007·8 cites·16 claims
- 0669US7122908B2Electronic device packageMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 17, 2006·13 cites·117 claims
- 0769US6757176B1Circuit boardMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 29, 2004·12 cites·25 claims
- 0868US11886975B2Methods and related aspects for pathology prognosisUNIV JOHNS HOPKINS·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 0967US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 1063US8023587B2Device and method for pre-distorting a base-band digital signalHUAWEI TECH CO LTD·Filed 2007·Granted Sep 20, 2011·6 cites·21 claims
- 1163US7691668B2Method and apparatus for multi-chip packagingSPANSION LLC·Filed 2006·Granted Apr 6, 2010·2 cites·8 claims
- 1263US2023193169A1Cleaner for electronic device componentsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1356US11825928B2Method of recommending cosmetics based on melanin index and hemoglobin index and device thereofCOCORY COLOR RES INSTITUTE INC·Filed 2021·Granted Nov 28, 2023·0 cites·2 claims
- 1451US7186034B2Optical fiber connector having stopping meansHON HAI PREC IND CO LTD·Filed 2004·Granted Mar 6, 2007·3 cites·14 claims
- 1549US2023342921A1Methods and related aspects for medical image generationUNIV JOHNS HOPKINS·Filed 2021·Application pending·0 cites
- 1647US8742602B2Vertical electrical interconnect formed on support prior to die mountCASKEY TERRENCE·Filed 2008·Granted Jun 3, 2014·0 cites·20 claims
- 1747US2005283975A1Circuit boardMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 1846US2024127433A1Methods and related aspects for classifying lesions in medical imagesUNIV JOHNS HOPKINS·Filed 2022·Application pending·0 cites
- 1946US2006220243A1Electronic device packageMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2045US2008315407A1Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabricationVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2145US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2242US2009289101A1Method for ball grid array (bga) solder attach for surface mountDU YONG·Filed 2008·Application pending·0 cites
- 2341US2004217463A1Circuit boardMICRON TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 2439US10790463B2Light emitting deviceNAJING TECH CORP LTD·Filed 2017·Granted Sep 29, 2020·0 cites·10 claims
- 2539US8324716B2Method and apparatus for multi-chip packagingDU YONG·Filed 2010·Granted Dec 4, 2012·0 cites·2 claims
- 2638US2024143033A1Flexible substrate, flexible display device having the same, and preparation method thereofNAJING TECH CORP LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →