Inventor · disambiguated record
Yoshinori Ejiri
Also filed as: EJIRI YOSHINORI
27 granted patents·17 pending applications·39 citations·filing 2008–2025
93Inventor score
Files withHITACHI CHEMICAL CO LTD16RESONAC CORP11SHOWA DENKO MATERIALS CO LTD10NAKAKO HIDEO4EJIRI YOSHINORI2
Top patents by PatentIndex Score
44 records- 0183US8426742B2Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor packageEJIRI YOSHINORI·Filed 2008·Granted Apr 23, 2013·14 cites·16 claims
- 0282US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0381US8997341B2Substrate for mounting semiconductor chip and method for producing sameEJIRI YOSHINORI·Filed 2010·Granted Apr 7, 2015·7 cites·12 claims
- 0480US2024282684A1Substrate and method for manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0578US12246398B2Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Mar 11, 2025·1 cites·8 claims
- 0678US11990396B2Substrate and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0778US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 0876US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0975US12233460B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 1073US11462502B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·2 cites·20 claims
- 1173US11370066B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 28, 2022·2 cites·20 claims
- 1271US10756008B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 1370US11562951B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1470US2025293091A1Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationRESONAC CORP·Filed 2025·Application pending·0 cites
- 1569US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 1666US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 1765US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 1865US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 1963US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 2062US2025205799A1Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpRESONAC CORP·Filed 2025·Application pending·0 cites
- 2158US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 2258US2018021708A1Biomolecule capturing filterHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2356US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 2456US2014299539A1Biomolecule capturing filterHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 2556US2025387833A1Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal pasteRESONAC CORP·Filed 2024·Application pending·0 cites
- 2653US12354914B2Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 8, 2025·0 cites·13 claims
- 2752US2024424614A1Metal paste for bonding, and bonded body and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 2852US2024300055A1Metal paste for joining, joint, and manufacturing method thereforRESONAC CORP·Filed 2022·Application pending·0 cites
- 2951US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 3050US12100923B2Connection structure and manufacturing method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·6 claims
- 3150US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 3249US11512214B2Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductorHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 29, 2022·0 cites·17 claims
- 3349US2013295276A1Method for forming a copper wiring patternHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3448US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 3544US11890681B2Method for producing bonded object and semiconductor device and copper bonding pasteSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Feb 6, 2024·0 cites·9 claims
- 3643US2024105653A1Solder paste, method for forming solder bumps, and method for producing member with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 3743US2024297135A1Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 3842US11483936B2Method for producing joined body, and joining materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·17 claims
- 3942US10748865B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·17 claims
- 4039US11040416B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·8 claims
- 4139US2012104333A1Coated conductive particles and method for producing sameTAKAI KENJI·Filed 2010·Application pending·0 cites
- 4239US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
- 4338US11887960B2Member connection methodHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 30, 2024·0 cites·5 claims
- 4436US11575076B2Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion moduleHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →