Inventor · disambiguated record
Yoshio Fukayama
Also filed as: FUKAYAMA YOSHIO
10 granted patents·1 pending application·132 citations·filing 2003–2016
90Inventor score
Files withRENESAS TECH CORP5KANAOKA TAKU2RENESAS ELECTRONICS CORP2HITACHI ULSI SYS CO LTD1SEKIGUCHI KAZUYA1
Top patents by PatentIndex Score
11 records- 0193US7342302B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·20 cites·31 claims
- 0292US7759804B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·20 cites·4 claims
- 0389US7102223B1Semiconductor device and a method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Sep 5, 2006·38 cites·34 claims
- 0486US8183691B2Semiconductor device with pads overlapping wiring layers including dummy wiringKANAOKA TAKU·Filed 2010·Granted May 22, 2012·7 cites·9 claims
- 0582US7256125B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Aug 14, 2007·30 cites·18 claims
- 0667US7346412B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Mar 18, 2008·12 cites·1 claims
- 0763US7601635B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Oct 13, 2009·2 cites·16 claims
- 0862US8198162B2Semiconductor device and a method of manufacturing the sameSEKIGUCHI KAZUYA·Filed 2009·Granted Jun 12, 2012·3 cites·19 claims
- 0957US10199338B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·0 cites·15 claims
- 1056US2014159245A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1152US8669659B2Semiconductor device and a method of manufacturing the sameKANAOKA TAKU·Filed 2012·Granted Mar 11, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →