Inventor · disambiguated record
You Ge
Also filed as: GE YOU
18 granted patents·13 pending applications·46 citations·filing 2012–2025
91Inventor score
Top patents by PatentIndex Score
31 records- 0193US9355945B1Semiconductor device with heat-dissipating lead frameFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 31, 2016·12 cites·10 claims
- 0289US9548255B1IC package having non-horizontal die pad and flexible substrate thereforFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jan 17, 2017·7 cites·19 claims
- 0389US9379035B1IC package having non-horizontal die pad and lead frame thereforFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 28, 2016·7 cites·19 claims
- 0486US11515238B2Power die packageNXP USA INC·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0584US10041195B2Woven signal-routing substrate for wearable electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 7, 2018·3 cites·17 claims
- 0676US9484289B2Semiconductor device with heat spreaderGE YOU·Filed 2014·Granted Nov 1, 2016·5 cites·12 claims
- 0776US8901722B2Semiconductor device with integral heat sinkGE YOU·Filed 2013·Granted Dec 2, 2014·5 cites·19 claims
- 0873US9449901B1Lead frame with deflecting tie bar for IC packageFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 20, 2016·2 cites·13 claims
- 0968US9190343B1Semiconductor device with tube based heat spreaderGE YOU·Filed 2014·Granted Nov 17, 2015·2 cites·18 claims
- 1062US11456188B2Method of making flexible semiconductor device with graphene tapeNXP USA INC·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 1161US2025062217A1Packaged semiconductor device and method of manufacturingNXP USA INC·Filed 2024·Application pending·0 cites
- 1261US2025218878A1Lidded electronic package containing a batteryNXP USA INC·Filed 2024·Application pending·0 cites
- 1360US2025112128A1Packaged semiconductor device and method of making thereofNXP USA INC·Filed 2024·Application pending·0 cites
- 1460US2025132212A1Qfn packaged semiconductor device and methodNXP USA INC·Filed 2024·Application pending·0 cites
- 1559US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 1659US2025006596A1Qfn packaged semiconductor device and method of making thereofNXP USA INC·Filed 2024·Application pending·0 cites
- 1758US2024413030A1Packaged semiconductor device and method of manufacturingNXP USA INC·Filed 2024·Application pending·0 cites
- 1858US2024413065A1Packaged semiconductor devices and methods of making the sameNXP USA INC·Filed 2024·Application pending·0 cites
- 1956US11984408B2Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formationNXP USA INC·Filed 2021·Granted May 14, 2024·0 cites·19 claims
- 2055US2023110402A1Semiconductor device and method for packagingNXP USA INC·Filed 2022·Application pending·0 cites
- 2155US2023115182A1Semiconductor device qfn package and method of making thereofNXP USA INC·Filed 2022·Application pending·0 cites
- 2253US12051642B2QFN semiconductor package, semiconductor package and lead frameNXP USA INC·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 2353US2025385173A1Packaged semiconductor device and method for packagingNXP USA INC·Filed 2025·Application pending·0 cites
- 2451US11171077B2Semiconductor device with lead frame that accommodates various die sizesNXP USA INC·Filed 2020·Granted Nov 9, 2021·0 cites·14 claims
- 2551US10692802B2Flexible semiconductor device with graphene tapeNXP USA INC·Filed 2016·Granted Jun 23, 2020·0 cites·10 claims
- 2651US2023097173A1Type of bumpless and wireless semiconductor deviceNXP USA INC·Filed 2022·Application pending·0 cites
- 2750US2023068886A1Packaged semiconductor device, leadframe and method for improved bondingNXP USA INC·Filed 2022·Application pending·0 cites
- 2844US2022338702A1Base station and cleaning systemSUZHOU 360 ROBOTIC TECH CO LTD·Filed 2021·Application pending·0 cites
- 2941US10217697B2Semiconductor device and lead frame with high density lead arrayNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·9 claims
- 3040US8980690B1Lead frame based semiconductor device with routing substrateMEI PENGLIN·Filed 2014·Granted Mar 17, 2015·0 cites·20 claims
- 3139US8643153B2Semiconductor device with staggered leadsQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →