Inventor · disambiguated record
Yohei Gokita
Also filed as: GOKITA YOHEI
2 granted patents·2 pending applications·0 citations·filing 2010–2023
22Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0142US2024017368A1Method of and apparatus for grinding waferDISCO CORP·Filed 2023·Application pending·0 cites
- 0233US2011097875A1Wafer processing methodDISCO CORP·Filed 2010·Application pending·0 cites
- 0332US11482407B2Wafer grinding methodDISCO CORP·Filed 2020·Granted Oct 25, 2022·0 cites·3 claims
- 0418US8409969B2Optical device wafer processing methodGOKITA YOHEI·Filed 2011·Granted Apr 2, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →